參數(shù)資料
型號(hào): HS9-RTX2010RH
廠商: Intersil Corporation
英文描述: Radiation Hardened Real Time Express⑩ Microcontroller
中文描述: 輻射加固實(shí)時(shí)快遞⑩微控制器
文件頁數(shù): 36/36頁
文件大小: 406K
代理商: HS9-RTX2010RH
36
All Intersil semiconductor products are manufactured, assembled and tested under
ISO9000
quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site
www.intersil.com
Die Characteristics
DIE DIMENSIONS:
364 mils x 371 mils x 21 mils
±
1mil
INTERFACE MATERIALS:
Glassivation:
Type: SiO
2
Thickness: 8k
±
1k
Top Metallization:
Type: Al/Si/Cu
Thickness: 7.5k
±
2k
Substrate:
TSOS5 CMOS,
Silicon on Sapphire
Backside Finish:
Silicon
ASSEMBLY RELATED INFORMATION:
Substrate Potential:
Unbiased (SOS)
ADDITIONAL INFORMATION:
Worst Case Current Density:
1.0 x 10
5
A/cm
2
Metallization Mask Layout
HS-RTX2010RH
M
M
M
V
M
M
M
M
M
G
M
M
M
M
M
M
M
M
G
G
G
GND (32)
GD03 (31)
GD04 (30)
GD05 (29)
GD06 (28)
VCC (27)
GD07 (26)
GD08 (25)
GD09 (24)
GD10 (23)
GD11 (22)
GD12 (21)
GND (20)
GD13 (19)
GD14 (18)
GD15 (17)
GIO (16)
GR/W (15)
ICLK (14)
WAIT (13)
RESET (12)
(
(
(
(
(
(
(
(
(
(
(
(
(
(
(
(
(
(
(
(
(
(74) MD08
(73) VCC
(72) MD07
(71) MD06
(70) MD05
(69) GND
(68) MD04
(67) MD03
(66) MD02
(65) MD01
(64) MD00
(63) MR/W
(62) PCLK
(61) BOOT
(60) NEW
(59) UDS
(58) LDS
(57) GND
(56) MA19
(55) MA18
(54) MA17
HS-RTX2010RH
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