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參數(shù)資料
| 型號： | HN2E01F |
| 廠商： | Toshiba Corporation |
| 英文描述： | MULTI CHIP DISCRETE DEVICE Super High Speed Switching Application |
| 中文描述： | 多芯片分立器件超高速開關(guān)應(yīng)用 |
| 文件頁數(shù)： | 1/7頁 |
| 文件大?。?/td> | 511K |
| 代理商： | HN2E01F |
HN2E01F
2007-11-22
1
TOSHIBA MULTI CHIP DISCRETE DEVICE
HN2E01F
Super High Speed Switching Application
Audio Frequency Amplifier Application
General Switching Application
Q1
Q2
Low Forward Voltage Drop :
Fast Reverse Recovery Time
Low Total Capacitance :
V
F(3
)=0.98V(typ.)
t
rr
=1.6ns(typ.)
C
T
=0.5pF(typ.)
Q1 (Diode) Absolute Maximum Ratings
(Ta = 25°C)
High DC Current Gain :
High Voltage :
High Collector Current :
h
FE
=600~3600
V
CEO
=50V
I
C
=150mA(max.)
Q1 (Diode)
Q2 (Transistor)
:
:
1SS352 Equivalent
2SC4666 Equivalent
Characteristic
Symbol
Rating
Unit
Maximum (peak) reverse voltage
V
RM
85
V
Reverse voltage
V
R
80
V
Maximum (peak) forward current
I
FM
300
mA
Average forward current
I
O
100
mA
Surge current (10ms)
I
FSM
1
A
Q2 (Transistor) Absolute Maximum Ratings (
Ta = 25°C
)
Characteristic
Symbol
Rating
Unit
Collector-base voltage
V
CBO
50
V
Collector-emitter voltage
V
CEO
50
V
Emitter-base voltage
V
EBO
5
V
Collector current
I
C
150
mA
Base current
I
B
30
mA
Absolute Maximum Ratings
(Ta = 25°C) (Q1, Q2 Common)
Characteristic
Symbol
Rating
Unit
Collector power dissipation
P
C
*
300
mW
Junction temperature
T
j
125
°
C
Storage temperature range
T
stg
55~125
°
C
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if
the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
* Total rating: 200mW per element should not be exceeded.
1.Anode
2.Base
3.Collector
4.Emitter
5.NC
6.Cathode
JEDEC
―
JEITA
―
TOSHIBA
2-3N1D
Weight: 0.015g (typ.)
Unit: mm
相關(guān)PDF資料 |
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| HN2E01F_07 | MULTI CHIP DISCRETE DEVICE Super High Speed Switching Application |
| HN2E02F | Super High Speed Switching Application |
| HN2E04F | MULTI CHIP DISCRETE DEVICE Super High Speed Switching Application |
| HN2E05J | MULTI CHIP DISCRETE DEVICE Super High Speed Switching Application |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HN2E01F_07 | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:MULTI CHIP DISCRETE DEVICE Super High Speed Switching Application |
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| HN2E04F | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:MULTI CHIP DISCRETE DEVICE Super High Speed Switching Application |
| HN2E05J | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:MULTI CHIP DISCRETE DEVICE Super High Speed Switching Application |
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