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參數(shù)資料
| 型號(hào)： | HMMC-5200 |
| 元件分類： | 放大器 |
| 英文描述： | 0 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封裝： | DIE-8 |
| 文件頁(yè)數(shù)： | 5/6頁(yè) |
| 文件大?。?/td> | 45K |
| 代理商： | HMMC-5200 |
5
Figure 4. HMMC-5200 Assembly Diagram.
Figure 5. HMMC-5200 Bonding Pad Positions.
(all dimensions in microns)
RF INPUT
Cblock
Lchoke
[2]
Rout
5V
≤ Vsupply
RCC
RF OUTPUT
[1]
If 4.75V
≤ V
supply ≤ 7V, RCC = 0
If Vsupply > 7V, RCC = [(Vsupply – 6.5) * (1/0.01725)]
Rout = [(Vsupply – 3.2) * (1/0.028)]
Notes:
Blocking Cap required on input and output.
1. For optimum performance, the input and output
bond wire inductances should each be 0.1–0.3 nH.
(bond wire has about 20 pH/mil of inductance).
2. Lchoke is optional if Rout is greater than 300,
however, gain will be reduced by about 0.5 dB.
GND
IN
OUT
GND
VCC
GND
0
410
240
390
0
90
70
340
175
460
GND
IN
OUT
GND
VCC
GND
This data sheet contains a variety of typical performance data. The information supplied
should not be interpreted as a complete list of circuit specifications. In this data sheet
the term typical refers to the 50th percentile performance. For additional information
contact your local HP sales representative.
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