參數(shù)資料
型號: HMMC-5023
元件分類: 放大器
英文描述: 21200 MHz - 26500 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
封裝: 0.074 X 0.0236 INCH, DIE
文件頁數(shù): 6/7頁
文件大?。?/td> 102K
代理商: HMMC-5023
6
Gold Plated Shim (Optional)
To VDD
DC Power Supply
≥20 pF Capacitor
RFIN
VD1
VD2
RFOUT
≥20 pF Capacitor
R (typ.)
≥90
RFIN
VG2
VD1
VD2
R
RFOUT
R
RFIN
VG2
VD1
VD2
RFOUT
≥20 pF Capacitor
RFIN
VG2
VD1
VD2
RFOUT
To VD2
DC Power Supply
To VG2
DC Power Supply
(Optional)
To VD1
DC Power Supply
Figure 9a. Single DC Drain Supply.
Figure 9b. Assembly for custom biasing of output gain stages using
an external chip resistor.
Figure 9c. A V
G2 DC supply or a resistive divider network can also be used to bias the output stages for custom applications.
Figure 9. HMMC-5023 Assembly Diagram Examples.
相關(guān)PDF資料
PDF描述
HMMC-5025 2000 MHz - 50000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
HMMC-5025 2000 MHz - 50000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
HMMC-5026 2000 MHz - 26500 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
HMMC-5021 2000 MHz - 22000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
HMMC-5027 2000 MHz - 26500 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HMMC-5025 制造商:Agilent Technologies 功能描述:RF AMP MOD SGL GP AMP 50GHZ 7V - Gel-pak, waffle pack, wafer, diced wafer on film
HMMC-5026 制造商:Agilent Technologies 功能描述:RF AMP MOD SGL GP AMP 26.5GHZ 8V - Gel-pak, waffle pack, wafer, diced wafer on film
HMMC-5027 制造商:Agilent Technologies 功能描述:RF AMP MOD SGL PWR AMP 26.5GHZ 8V CHIP - Gel-pak, waffle pack, wafer, diced wafer on film
HMMC-5032 制造商:Agilent Technologies 功能描述:RF AMP MOD SGL PWR AMP 32GHZ 5V - Gel-pak, waffle pack, wafer, diced wafer on film
HMMC-5033 制造商:Agilent Technologies 功能描述:RF AMP MOD SGL PWR AMP 32GHZ 5V - Gel-pak, waffle pack, wafer, diced wafer on film