參數(shù)資料
型號: HGTP3N60C3
廠商: FAIRCHILD SEMICONDUCTOR CORP
元件分類: 功率晶體管
英文描述: 72 MACROCELL 3.3 VOLT ISP CPLD
中文描述: 6 A, 600 V, N-CHANNEL IGBT, TO-220AB
文件頁數(shù): 8/10頁
文件大?。?/td> 156K
代理商: HGTP3N60C3
8
HGTD3N60A4S, HGT1S3N60A4S, HGTP3N60A4
TO-252AA
SURFACE MOUNT JEDEC TO-252AA PLASTIC PACKAGE
TO-252AA
16mm TAPE AND REEL
b
2
E
D
L
3
L
e
b
1
b
1
3
A
L
c
SEATING
PLANE
BACK VIEW
2
H
1
A
1
b
3
e
1
J
1
L
1
TERM. 4
0.265
(6.7)
MINIMUM PAD SIZE RECOMMENDED FOR
SURFACE-MOUNTED APPLICATIONS
0.265 (6.7)
0.070 (1.8)
0.118 (3.0)
0.063 (1.6) TYP
0.090 (2.3) TYP
SYMBOL
A
A
1
b
b
1
b
2
b
3
c
D
E
e
e
1
H
1
J
1
L
L
1
L
2
L
3
NOTES:
1. These dimensions are within allowable dimensions of Rev. B of
JEDEC TO-252AA outline dated 9-88.
2. L
3
and b
3
dimensions establish a minimum mounting surface for
terminal 4.
3. Solder finish uncontrolled in this area.
4. Dimension (without solder).
5. Add typically 0.002 inches (0.05mm) for solder plating.
6. L
1
is the terminal length for soldering.
7. Positionofleadtobemeasured0.090inches(2.28mm)frombottom
of dimension D.
8. Controlling dimension: Inch.
9. Revision 9 dated 5-99.
INCHES
MIN
0.086
0.018
0.028
0.033
0.205
0.190
0.018
0.270
0.250
0.090 TYP
0.180 BSC
0.035
0.040
0.100
0.020
0.025
0.170
MILLIMETERS
MIN
2.19
0.46
0.72
0.84
5.21
4.83
0.46
6.86
6.35
2.28 TYP
4.57 BSC
0.89
1.02
2.54
0.51
0.64
4.32
NOTES
-
4, 5
4, 5
4
4, 5
2
4, 5
-
-
7
7
-
-
-
4, 6
3
2
MAX
0.094
0.022
0.032
0.040
0.215
-
0.022
0.290
0.265
MAX
2.38
0.55
0.81
1.01
5.46
-
0.55
7.36
6.73
0.045
0.045
0.115
-
0.040
-
1.14
1.14
2.92
-
1.01
-
2.0mm
4.0mm
1.5mm
DIA. HOLE
8.0mm
16mm
USER DIRECTION OF FEED
C
1.75mm
330mm
50mm
13mm
22.4mm
16.4mm
COVER TAPE
GENERAL INFORMATION
1. 2500 PIECES PER REEL.
2. ORDER IN MULTIPLES OF FULL REELS ONLY.
3. MEETS EIA-481 REVISION "A" SPECIFICATIONS.
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