參數(shù)資料
型號(hào)： HD64F3028
英文描述： Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
中文描述： 微機(jī)開發(fā)環(huán)境系統(tǒng)高性能的Embedded Workshop 2福利部生成器用戶手冊(cè)/交叉工具的性能
文件頁數(shù)： 46/67頁
文件大?。?/td> 382K
代理商： HD64F3028
Rev. 2.0, 03/06/02, 41
The fourth and final step (figure 3.3e) allows you to specify any environment variables, which the phase
requires.
Figure 3.3e: New Build Phase Dialog (Step 4)
To add a new environment variable click the “Add…” button (the dialog shown in figure 3.4 will be invoked).
Enter the variable name into the “Variable” field and the variable’s value into the “Value” field and then click
“OK” to add the new variable to the list of the fourth step. To modify an environment variables select the
variable in the list and then click the “Modify…” button. Make the required changes to the “Variable” and
“Value” fields and then click “OK” to add the modified variable to the list. To remove environment variables
select the variable that you want to remove from the list and then click the “Remove” button.
Figure 3.4: Environment Variable Dialog
If the tool you are adding can display its output as the tool is running then use the ‘Read Output On Fly’ option.
This will display the tool output as each line of output happens. If this option is set to off then the HEW will
store all output, which is being displayed by the tool, and display it in the output window when the tool has
finished its operation. This can be a problem when the tool is running an operation that might take many
minutes, as it is difficult to see the progress of the current execution.
Note:
Using ‘Read Output On Fly’ can cause problems when using certain tools on certain operating systems.
If you are having problems with tools locking up or freezing in HEW then uncheck the ‘Read Output On
Fly’ option.
Click the “Finish” button to create the new phase. By default the new phase is added to the bottom of the “Build
Phase Order” list in the “Build Order” tab of the “Build Phases” dialog (Figure ).
相關(guān)PDF資料
PDF描述
HD64F3039 Htachi Single-Chip Microcomputer H8/3039 Series H8/3039.H8/3038 H8/3037.H8/3036 H8/3039 F-ZTAT Hardware Manual
HD64F3039F Microcontroller
HD64F3039TE Microcontroller
HD64F3039VF Microcontroller
HD64F3039VTE Microcontroller
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HD64F3028F25V 制造商:Renesas Electronics Corporation 功能描述:
HD64F3028TE25 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8 CISC 384KB FLASH 3.3V 100TQFP - Trays
HD64F3028X25 功能描述:IC H8 MCU FLASH 384K 100TQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8/300H 產(chǎn)品培訓(xùn)模塊:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 標(biāo)準(zhǔn)包裝:1 系列:M16C™ M32C/80/87 核心處理器:M32C/80 芯體尺寸:16/32-位 速度:32MHz 連通性:EBI/EMI，I²C，IEBus，IrDA，SIO，UART/USART 外圍設(shè)備:DMA，POR，PWM，WDT 輸入/輸出數(shù):121 程序存儲(chǔ)器容量:384KB（384K x 8） 程序存儲(chǔ)器類型:閃存 EEPROM 大小:- RAM 容量:24K x 8 電壓 - 電源 (Vcc/Vdd):3 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 34x10b，D/A 2x8b 振蕩器型:內(nèi)部 工作溫度:-20°C ~ 85°C 封裝/外殼:144-LQFP 包裝:托盤 產(chǎn)品目錄頁面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87
HD64F3029F25 制造商:Renesas Electronics Corporation 功能描述:
HD64F3029F25V 制造商:Renesas Electronics 功能描述:16 H8/300H 25MHz 100QFP 512KB Tray 制造商:Renesas Electronics Corporation 功能描述:Micro,H8/3029,ROM 512k FL,RAM 制造商:Renesas 功能描述:MCU 16-Bit/32-Bit H8 CISC 512KB Flash 3.3V 100-Pin PQFP
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購

我的聯(lián)系方式

*
*
*