參數(shù)資料
型號(hào)： HD64F3028
英文描述： Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
中文描述： 微機(jī)開發(fā)環(huán)境系統(tǒng)高性能的Embedded Workshop 2福利部生成器用戶手冊(cè)/交叉工具的性能
文件頁(yè)數(shù)： 40/67頁(yè)
文件大小： 382K
代理商： HD64F3028
Rev. 2.0, 03/06/02, 36
3.
Advanced Build Features
This chapter explains the more advanced build concepts.
3.1
The Build Process Revisited
Chapter 2, “Build Basics” began by describing the build process in terms of a compiler, an assembler and a
linker (figure 2.1). This will be the case for most installations of the Hitachi Embedded Workshop. However, if
you want to begin changing the build process (e.g. adding and removing phases) then it is important to
understand more about the way in which a build functions.
3.1.1
What is a Build?
Building a project means applying a set of tools upon certain input files in order to produce the desired output.
Thus, we apply a compiler upon C/C++ source files in order to create object files, we apply an assembler upon
assembler source files in order to create object files and so forth. At each step or “phase” of the build, we apply a
different tool upon a different set of input files. Figure 3.1 presents another view of the build process.
BEGIN
END
PHASE 1
PHASE 2
PHASE 3
PHASE X
Phase 1 Output Files
Phase 2 Output Files
Phase 1 Input Files
Phase 2 Input Files
Phase 3 Output Files
Phase X Output Files
Phase 3 Input Files
Phase X Input Files
Figure 3.1: Build Process
相關(guān)PDF資料
PDF描述
HD64F3039 Htachi Single-Chip Microcomputer H8/3039 Series H8/3039.H8/3038 H8/3037.H8/3036 H8/3039 F-ZTAT Hardware Manual
HD64F3039F Microcontroller
HD64F3039TE Microcontroller
HD64F3039VF Microcontroller
HD64F3039VTE Microcontroller
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HD64F3028F25V 制造商:Renesas Electronics Corporation 功能描述:
HD64F3028TE25 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8 CISC 384KB FLASH 3.3V 100TQFP - Trays
HD64F3028X25 功能描述:IC H8 MCU FLASH 384K 100TQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8/300H 產(chǎn)品培訓(xùn)模塊:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 標(biāo)準(zhǔn)包裝:1 系列:M16C™ M32C/80/87 核心處理器:M32C/80 芯體尺寸:16/32-位 速度:32MHz 連通性:EBI/EMI，I²C，IEBus，IrDA，SIO，UART/USART 外圍設(shè)備:DMA，POR，PWM，WDT 輸入/輸出數(shù):121 程序存儲(chǔ)器容量:384KB（384K x 8） 程序存儲(chǔ)器類型:閃存 EEPROM 大小:- RAM 容量:24K x 8 電壓 - 電源 (Vcc/Vdd):3 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 34x10b，D/A 2x8b 振蕩器型:內(nèi)部 工作溫度:-20°C ~ 85°C 封裝/外殼:144-LQFP 包裝:托盤 產(chǎn)品目錄頁(yè)面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87
HD64F3029F25 制造商:Renesas Electronics Corporation 功能描述:
HD64F3029F25V 制造商:Renesas Electronics 功能描述:16 H8/300H 25MHz 100QFP 512KB Tray 制造商:Renesas Electronics Corporation 功能描述:Micro,H8/3029,ROM 512k FL,RAM 制造商:Renesas 功能描述:MCU 16-Bit/32-Bit H8 CISC 512KB Flash 3.3V 100-Pin PQFP
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