參數(shù)資料
型號(hào): GS881Z32CGD-150VT
廠商: GSI TECHNOLOGY
元件分類: SRAM
英文描述: 256K X 32 ZBT SRAM, 7.5 ns, PBGA165
封裝: 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
文件頁(yè)數(shù): 33/37頁(yè)
文件大?。?/td> 1239K
代理商: GS881Z32CGD-150VT
100-Pin TQFP Pin Descriptions
Symbol
Type
Description
A0, A1
In
Burst Address Inputs; Preload the burst counter
A
In
Address Inputs
CK
In
Clock Input Signal
BA
In
Byte Write signal for data inputs DQA; active low
BB
In
Byte Write signal for data inputs DQB; active low
BC
In
Byte Write signal for data inputs DQC; active low
BD
In
Byte Write signal for data inputs DQD; active low
W
In
Write Enable; active low
E1
In
Chip Enable; active low
E2
In
Chip Enable—Active High. For self decoded depth expansion
E3
In
Chip Enable—Active Low. For self decoded depth expansion
G
In
Output Enable; active low
ADV
In
Advance/Load; Burst address counter control pin
CKE
In
Clock Input Buffer Enable; active low
NC
No Connect
DQA
I/O
Byte A Data Input and Output pins
DQB
I/O
Byte B Data Input and Output pins
DQC
I/O
Byte C Data Input and Output pins
DQD
I/O
Byte D Data Input and Output pins
DQPA
I/O
9th Data I/O Pin; Byte A
DQPB
I/O
9th Data I/O Pin; Byte B
DQPC
I/O
9th Data I/O Pin; Byte C
DQPD
I/O
9th Data I/O Pin; Byte D
ZZ
In
Power down control; active high
FT
In
Pipeline/Flow Through Mode Control; active low
LBO
In
Linear Burst Order; active low.
TMS
Scan Test Mode Select
TDI
Scan Test Data In
TDO
Scan Test Data Out
TCK
Scan Test Clock
VDD
In
Core power supply
VSS
In
Ground
VDDQ
In
Output driver power supply
GS881Z18/32/36C(T/D)-xxxV
Rev: 1.00a 10/2009
5/37
2008, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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