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參數(shù)資料
| 型號(hào)： | GFD2206 |
| 英文描述： | TRANSISTOR | MOSFET | N-CHANNEL | 60V V(BR)DSS | 42A I(D) | TO-252AA |
| 中文描述： | 晶體管| MOSFET的| N溝道| 60V的五（巴西）直| 42A條（?。﹟對(duì)252AA |
| 文件頁數(shù)： | 1/4頁 |
| 文件大小： | 87K |
| 代理商： | GFD2206 |
GFD2206
N-Channel Enhancement-Mode MOSFET
V
DS
60V
R
DS(ON)
22
m
I
D
42A
Features
Advanced Trench Process Technology
High Density Cell Design for Ultra Low On-Resistance
Rugged-Avalanche Energy Rated
Fast Switching for High Efficiency
Mechanical Data
Case:
JEDEC TO-252 molded plastic body
Terminals:
Solder plated, solderable per MIL-STD-750,
Method 2026
High temperature soldering guaranteed:
250°C/10 seconds at terminals
Weight:
0.011oz., 0.4g
Maximum Ratings and Thermal Characteristics
(T
C
= 25
°
C unless otherwise noted)
Parameter
0.190
(4.826)
0.243
(6.172)
0.063
(1.6)
0.165
(4.191)
0.100
(2.54)
0.118
(3.0)
0.245 (6.22)
0.235 (5.97)
0.040 (1.02)
0.025 (0.64)
0.410 (10.41)
0.380 (9.65)
0.170 (4.32) min.
0.214 (5.44)
0.206 (5.23)
D
0.265 (6.73)
0.255 (6.48)
0.023 (0.58)
0.018 (0.46)
0.094 (2.39)
0.087 (2.21)
0.204 (5.18)
0.156 (3.96)
0.197 (5.00)
0.177 (4.49)
0.035 (0.89)
0.028 (0.71)
G
S
0.023 (0.58)
0.018 (0.46)
0.045 (1.14)
0.035 (0.89)
0.009 (0.23)
0.001 (0.03)
0.min.
0.060 (1.52)
0.045 (1.14)
0.050 (1.27)
0.035 (0.89)
TO-252 (DPAK)
Dimensions in inches
and (millimeters)
Mounting Pad Layout
G
D
S
T
RENCH
G
EN
F
ET
NewProduct
Symbol
Limit
Unit
Drain-Source Voltage
V
DS
60
±
20
V
Gate-Source Voltage
V
GS
V
Continuous Drain Current
V
GS
=10V
Pulsed Drain Current
(1)
T
C
= 25
°
C
T
C
= 100
°
C
I
D
42
26
A
I
DM
100
Maximum Power Dissipation
Single Pulse Avalanche Energy
(2)
Avalanche Current
(1)
Repetitive Avalanche Energy
(1)
T
C
= 25
°
C
P
D
62.5
W
E
AS
210
mJ
I
AR
21
A
E
AR
11
mJ
Operating Junction and Storage Temperature Range
T
J
, T
stg
–
55 to 150
°
C
Junction-to-Case Thermal Resistance
Junction-to-Ambient Thermal Resistance
(3)
R
θ
JC
2
°
C/W
R
θ
JA
40
Notes:
(1) Repetitive rating; pulse width limited by max. junction temperature
(2) V
DD
= 30V, starting T
J
= 25
°
C, L = 470
μ
H, R
G
= 25
, I
AS
= 21A
(3) Mounted on 1in
2
, 2oz. Cu pad on PCB
7/17/01
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