參數(shù)資料
型號(hào): FT232HL-REEL
廠商: FTDI, Future Technology Devices International Ltd
文件頁(yè)數(shù): 58/65頁(yè)
文件大?。?/td> 0K
描述: IC HS USB TO UART/FIFO 48LQFP
應(yīng)用說(shuō)明: FT1248 Application Note
標(biāo)準(zhǔn)包裝: 1
通道數(shù): 1,UART
FIFO's: 4kb
規(guī)程: RS232,RS422,RS485
電源電壓: 1.62 V ~ 1.98 V,2.97 V ~ 3.63 V
帶并行端口:
帶故障啟動(dòng)位檢測(cè)功能:
帶調(diào)制解調(diào)器控制功能:
安裝類型: 表面貼裝
封裝/外殼: 48-LQFP
供應(yīng)商設(shè)備封裝: 48-LQFP(7x7)
包裝: 標(biāo)準(zhǔn)包裝
其它名稱: 768-1101-6
Copyright 2012 Future Technology Devices International Limited
61
Document No.: FT_000288
FT232H SINGLE CHANNEL HI-SPEED USB TO MULTIPURPOSE UART/FIFO IC
Datasheet Version 1.8
Clearance No.: FTDI #199
Profile Feature
Pb Free Solder Process
(green material)
SnPb Eutectic and Pb free (non
green material) Solder Process
Average Ramp Up Rate (Ts to Tp)
3°C / second Max.
3°C / Second Max.
Preheat
- Temperature Min (Ts Min.)
- Temperature Max (Ts Max.)
- Time (ts Min to ts Max)
150°C
200°C
60 to 120 seconds
100°C
150°C
60 to 120 seconds
Time Maintained Above Critical Temperature
TL:
- Temperature (TL)
- Time (tL)
217°C
60 to 150 seconds
183°C
60 to 150 seconds
Peak Temperature (Tp)
260°C
Time within 5°C of actual Peak Temperature
(tp)
30 to 40 seconds
20 to 40 seconds
Ramp Down Rate
6°C / second Max.
Time for T= 25°C to Peak Temperature, Tp
8 minutes Max.
6 minutes Max.
Table 8.1 Reflow Profile Parameter Values
SnPb Eutectic and Pb free (non green material)
Package Thickness
Volume mm3 < 350
Volume mm3 >=350
< 2.5 mm
235 +5/-0 deg C
220 +5/-0 deg C
2.5 mm
220 +5/-0 deg C
Pb Free (green material) = 260 +5/-0 deg C
Table 8.2 Package Reflow Peak Temperature
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