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參數(shù)資料
| 型號(hào)： | FSA2269UMX |
| 廠商： | Fairchild Semiconductor |
| 文件頁(yè)數(shù)： | 3/14頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC SWITCH DUAL SPDT 10UMLP |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 功能： | 開關(guān) |
| 電路： | 2 x SPDT |
| 導(dǎo)通狀態(tài)電阻： | 300 毫歐 |
| 電壓電源： | 單電源 |
| 電壓 - 電源，單路/雙路(±)： | 1.65 V ~ 4.5 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 10-UFQFN |
| 供應(yīng)商設(shè)備封裝： | 10-UMLP |
| 包裝： | 標(biāo)準(zhǔn)包裝 |
| 產(chǎn)品目錄頁(yè)面： | 1218 (CN2011-ZH PDF) |
| 其它名稱： | FSA2269UMXDKR |
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2007 Fairchild Semiconductor Corporation
www.f airchildsemi.com
FSA2269 / FSA2269TS Rev. 1.1.5
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Physical Dimensions
Figure 20. 10-
Lead MicroPak
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions ,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
BOTTOM VIEW
TOP VIEW
RECOMMENDED LAND PATTERN
SIDE VIEW
2X
NOTES:
A. PACKAGE CONFORMS TO JEDEC
REGISTRATION MO-255, VARIATION UABD .
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
D. PRESENCE OF CENTER PAD IS PACKAGE
SUPPLIER DEPENDENT. IF PRESENT IT
IS NOT INTENDED TO BE SOLDERED AND
HAS A BLACK OXIDE FINISH.
E. DRAWING FILENAME: MKT-MAC10Arev5.
0.10 C
0.10
C A B
0.05
C
PIN1 IDENT IS
2X LONGER THAN
OTHER LINES
A
B
C
0.35
0.25
9X
1
4
9
6
0.25
0.15
10
5
0.50
0.56
1.62
0.05
0.00
0.05 C
0.55 MAX
0.05 C
1.60
2.10
(0.35)
(0.25)
0.50
10X
(0.11)
1.12
1.62
KEEPOUT ZONE, NO TRACES
OR VIAS ALLOWED
(0.20)
(0.15)
0.35
0.25
0.35
0.25
DETAIL A
DETAIL A 2X SCALE
0.35
0.25
0.65
0.55
D
ALL FEATURES
(0.36)
(0.29)
0.56
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