參數(shù)資料
型號(hào)： FSA2269UMX
廠商： Fairchild Semiconductor
文件頁(yè)數(shù)： 1/14頁(yè)
文件大小： 0K
描述： IC SWITCH DUAL SPDT 10UMLP
標(biāo)準(zhǔn)包裝： 1
功能： 開(kāi)關(guān)
電路： 2 x SPDT
導(dǎo)通狀態(tài)電阻： 300 毫歐
電壓電源： 單電源
電壓 - 電源，單路/雙路(±)： 1.65 V ~ 4.5 V
工作溫度： -40°C ~ 85°C
安裝類(lèi)型： 表面貼裝
封裝/外殼： 10-UFQFN
供應(yīng)商設(shè)備封裝： 10-UMLP
包裝： 標(biāo)準(zhǔn)包裝
產(chǎn)品目錄頁(yè)面： 1218 (CN2011-ZH PDF)
其它名稱： FSA2269UMXDKR
July 2013
2007 Fairchild Semiconductor Corporation
www.f airchildsemi.com
FSA2269 / FSA2269TS Rev. 1.1.5
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FSA2269 / FSA2269TS
— Low-Voltage Dual-SPDT (0.4 )
Analog Switch with Negative Swing Audio Capability
Features
0.4 Typical On Resistance (R
ON) for +3.0 V Supply
0.25 Maximum R
ON Flatness for +3.0 V Supply
-3 db Bandwidth: > 50 MHz
Low-I
CCT Current Over an Expanded Control Input
Range
Packaged in 10-Lead MicroPak, UMLP, and
WLCSP
Power-Off Protection on Common Ports
Broad V
CC Operating Range: 1.65 to 4.5 V
Noise Immunity Termination Resistors in FSA2269TS
Applications
Cell Phone, PDA, Digital Camera, and Notebook
LCD Monitor, TV, and Set-Top Box
Description
The FSA2269 is a high-performance, dual Single-Pole
Double-Throw (SPDT) analog switch with negative swing
audio capability. The FSA2269 features ultra-low RON of
0.4
(typical) at 3.0 V VCC. The FSA2269 operates over
a wide VCC range of 1.65 V to 4.5 V, is fabricated with
sub-micron CMOS technology to achieve fast switching
speeds,
and
is
designed
for
break-before-make
operation. The select input is TTL-level compatible.
The FSA2269 features very low quiescent current even
when the control voltage is lower than the VCC supply.
This feature suits mobile handset applications by
allowing
direct interface with baseband processor
general-purpose I/Os with minimal battery consumption.
The FSA2269TS includes termination resistors that
improve noise immunity during overshoot excursions,
off-
isolation coupling, or “pop-minimization.”
Ordering Information
Part Number
Top Mark
Package Description
FSA2269L10X
HL
10-Lead, MicroPak, JEDEC MO-255, 1.6 x 2.1 mm
FSA2269UMX
HP
10-Lead, Quad Ultrathin Molded Leadless Package (UMLP), 1.4 x 1.8 mm,
0.4 mm Pitch
FSA2269TSL10X
HU
10-Lead, MicroPak, JEDEC MO-255, 1.6 x 2.1 mm
FSA2269TSUMX
HT
10-Lead, Quad Ultrathin Molded Leadless Package(UMLP), 1.4 x 1.8 mm,
0.4 mm Pitch
FSA2269UCX
N9
12-Ball, Wafer-Level Chip Scale Package (WLCSP),1.2 x 1.6 mm, 0.4 mm Pitch
Analog Symbols
Figure 1. FSA2269
Figure 2. FSA2269TS (with Slow Turn On)
2B0
2B1
2A
GND
S2
10k
1B0
1B1
1A
GND
S1
10k
3s
tON
3s
tON
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