參數(shù)資料
型號: FMM5820QH
廠商: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
英文描述: Ka-Band Power Amplifier MMIC
中文描述: Ka波段單片功率放大器
文件頁數(shù): 12/14頁
文件大?。?/td> 380K
代理商: FMM5820QH
12
Ka-Band Power Amplifier MMIC
Mounting Instructions for QH Package
FMM5820QH
(1) The package may be attached using screws. Torque conditions are shown in Table 1.
(2) First, tighten the screws with a torque driver set to 5 N-cm.
(3) The surface finish of the heat sink should be better than 0.8
μ
m, and the surface flatness
must be better than 10
μ
m.
(4) Silicon based heat sink compounds should not be used for the thermal conductive grease.
They cause poor grounding of the source flange, contamination and long term degradation
of thermal resistance between the MMIC package and the heat sink.
(5) The DC and RF interconnects may be gold bondwires or gold ribbons. The RF interconnects
should be as short as possible.
Package
Recommended
screw
M1.6*
Recommended
Torque
15 N-cm (1.3 lb-in)
Maximum Torque
QH
20 N-cm (1.8 lb-in)
Table 1. Recommended and Maximum Torque for Screw Mounting
*Mounting with flat washer is recommended.
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