Tyco Electronics Corp.
11
Data Sheet
May 1999
dc-dc Converter; 18 Vdc to 36 Vdc Input, 28 Vdc Output; 250 W
FC250R Power Module:
Feature Descriptions
(continued)
Forced Load Sharing (Parallel Operation)
(continued)
Good layout techniques should be observed for noise
immunity. To implement forced load sharing, the follow-
ing connections must be made:
I
The parallel pins of all units must be connected
together. The paths of these connections should be
as direct as possible.
I
All remote-sense pins should be connected to the
power bus at the same point, i.e., connect all
SENSE(+) pins to the (+) side of the power bus at the
same point and all SENSE(–) pins to the (–) side of
the power bus at the same point. Close proximity and
directness are necessary for good noise immunity.
When not using the parallel feature, leave the
PARALLEL pin open.
8-581 (C)
Figure 17. Wiring Configuration for Redundant
Parallel Operation
Power Good Signal
The PWR GOOD pin provides an open-drain signal
(referenced to the SENSE(–) pin) that indicates the
operating state of the module. A low impedance
(<100
) between PWR GOOD and SENSE(–) indi-
cates that the module is operating. A high impedance
(>1 M
) between PWR GOOD and SENSE(–) indi-
cates that the module is off or has failed. The PWR
GOOD pin can be pulled up through a resistor to an
external voltage to facilitate sensing. This external volt-
age level must not exceed 40 V, and the current into the
PWR GOOD pin during the low-impedance state
should be limited to 1 mA maximum.
Thermal Considerations
Introduction
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation of the unit.
Heat-dissipating components inside the unit are ther-
mally coupled to the case. Heat is removed by conduc-
tion, convection, and radiation to the surrounding
environment. Proper cooling can be verified by mea-
suring the case temperature. Peak temperature occurs
at the position indicated in Figure 18.
Note: Top view, measurements shown in millimeters and (inches).
Pin locations are for reference only.
Figure 18. Case Temperature Measurement
Location
The temperature at this location should not exceed
100 °C. The maximum case temperature can be limited
to a lower value for extremely high reliability. The output
power of the module should not exceed the rated power
for the module as listed in the Ordering Information table.
For additional information about these modules, refer to
the Thermal Management for FC- and FW-Series 250
W—300 W Board-Mounted Power ModulesTechnical
Note (TN96-009EPS).
V
O
(+)
PARALLEL
SENSE(+)
SENSE(–)
V
O
(–)
CASE
ON/OFF
V
I
(+)
V
I
(–)
V
O
(+)
PARALLEL
SENSE(+)
SENSE(–)
V
O
(–)
CASE
ON/OFF
V
I
(+)
V
I
(–)
30.5
(1.20)
82.6
(3.25)
CASE
SYNC IN
SYNC OUT
V
I
(–)
ON/OFF
V
I
(+)
V
(–)
MEASURE CASE
TEMPERATURE HERE