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參數(shù)資料
| 型號(hào)： | FC15A140CC |
| 廠商： | ATMEL CORP |
| 元件分類(lèi)： | 模擬信號(hào)調(diào)理 |
| 英文描述： | SPECIALTY ANALOG CIRCUIT, CDIP20 |
| 封裝： | 0.300 INCH, CERAMIC, DIP-20 |
| 文件頁(yè)數(shù)： | 4/16頁(yè) |
| 文件大?。?/td> | 382K |
| 代理商： | FC15A140CC |
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FC15A140
12/16
Custom FingerChip
T
It will be possible to integrate any circuitry with the sensor as
FingerChip
T uses a standard CMOS process. Moreover, the
size of the sensor may be easily changed as well as resolution,
if needed.
TCS plans to integrate the Analog to Digital Converter on chip,
so that the user will see, from an external point of view, a full
digital device.
As explained before, it is not worthwhile to integrate a full pro-
cessor with the sensor, because of the cost. In some cases it
could be useful to integrate on–chip:
D the logic to ease communication (for instance a USB inter-
face, if speed problems are solved).
D a parallel to serial register to serialize data output by the
analog–to–digital converter, so it’s only one wire used
instead of 8 (but you will need a faster clock).
D the necessary logic to cypher communication, so that the
link with the host computer will be secure, and data can
travel through any network in total security.
Ask TCS for further information if needed.
Packaging and connecting FingerChip
T
TCS will start production using a Dual In Line ceramic pack-
age, 20 pins as it offers several advantages.
A DIL socket must be used. DIL sockets are very cheap, and
DIL packages are easy to handle as they are a standard. User
must take care that the device not be warmed above 90
_C, so
it is forbidden to solder the device.
TCS is also studying a Chip–On–Board (COB) solution for the
future. COB may lower the overall price of the device, if there
is enough production volume.
Mounting a COB device in a box must be carefully studied
because we must insure that the chip will be properly touched
during the sweeping: if the chip is in a hole, user cannot touch
the device, and if it is too high above the box, it may be broken
(see figure below).
Fitting the box to the COB causes a difficulty near the chip, as
some very thin material (as plastic) must be adjusted. Thick-
ness is the same as the chip, that is 0.6 mm.
Moreover, choosing an inexpensive and proper technique to
connect the COB to the motherboard is important.
The ceramic package will help the user in this task, as these
problems are solved (see figure below).
Chip On Board
Ceramic
0.6mm
Values to be confirmed
filled
plastic box
die
alignment
tolerance
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PDF描述 |
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| FC15A140CC | SPECIALTY ANALOG CIRCUIT, CDIP20 |
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| FC250B | 1-OUTPUT 250 W DC-DC REG PWR SUPPLY MODULE |
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