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| 型號： | EVAL-ADF4360-0EB1 |
| 廠商： | Analog Devices, Inc. |
| 元件分類： | XO, clock |
| 英文描述： | Integrated Synthesizer and VCO |
| 中文描述： | 綜合合成器和VCO |
| 文件頁數(shù)： | 19/20頁 |
| 文件大小： | 432K |
| 代理商： | EVAL-ADF4360-0EB1 |
ADF4360-0
PCB DESIGN GUIDELINES FOR CHIP SCALE PACKAGE
The leads on the chip scale package (CP-24) are rectangular.
The printed circuit board pad for these should be 0.1 mm
longer than the package lead length and 0.05 mm wider than
the package lead width. The lead should be centered on the pad
to ensure that the solder joint size is maximized.
Rev. 0 | Page 19 of 20
Experiments have shown that the circuit shown in Figure 20
provides an excellent match to 50 over the operating range of
the ADF4360-0. This gives approximately 4 dBm output power
across the frequency range of the ADF4360-0. Both single-
ended architectures can be examined using the EVAL-
ADF4360-0EB1 evaluation board.
3.9nH
47nH
1.5pF
0
RF
OUT
V
VCO
50
The bottom of the chip scale package has a central thermal pad.
The thermal pad on the printed circuit board should be at least
as large as this exposed pad. On the printed circuit board, there
should be a clearance of at least 0.25 mm between the thermal
pad and the inner edges of the pad pattern to ensure that short-
ing is avoided.
Figure 20. Differential ADF4360-0 Output Stage
Thermal vias may be used on the printed circuit board thermal
pad to improve thermal performance of the package. If vias are
used, they should be incorporated in the thermal pad at 1.2 mm
pitch grid. The via diameter should be between 0.3 mm and
0.33 mm, and the via barrel should be plated with 1 ounce of
copper to plug the via.
If the user does not need the differential outputs available on
the ADF4360-0, the user may either terminate the unused out-
put or combine both outputs using a balun. The circuit in
Figure 21 shows how best to combine the outputs.
1nH
3.6nH
47nH
3.6nH
1.5pF
10pF
1.5pF
50
1nH
RF
OUT
A
V
VCO
RF
OUT
B
0
The user should connect the printed circuit thermal pad to
AGND. This is internally connected to AGND.
OUTPUT MATCHING
There are a number of ways to match the output of the
ADF4360-0 for optimum operation; the most basic is to use a
50 resistor to V
VCO
. A dc bypass capacitor of 100 pF is con-
nected in series, as shown in Figure 19. Because the resistor is
not frequency dependent, this provides a good broadband
match. The output power in the circuit below typically gives
6.5 dBm output power into a 50 load.
Figure 21. Balun for Combining ADF4360-0 RF Outputs
The circuit in Figure 21 is a lumped lattice type LC balun. It is
designed for a center frequency of 2.6 GHz and outputs 1 dBm
at this frequency. The series 1 nH inductor is used to tune out
any parasitic capacitance due to the board layout from each
input, and the remainder of the circuit is used to shift the
output of one RF input by +90° and the second by 90°, thus
combining the two. The action of the 3.6 nH inductor and the
1.5 pF capacitor accomplishes this. The 12 nH is used to provide
an RF choke to feed the supply voltage, and the 10 pF capacitor
provides the necessary dc block. To ensure good RF perform-
ance, the circuits in Figure 19 and Figure 21 are implemented
with Coilcraft 0402/0603 inductors and AVX 0402 thin-film
capacitors.
100pF
0
RF
OUT
V
VCO
50
51
Figure 19. Simple ADF4360-1 Output Stage
A better solution is to use a shunt inductor (acting as an RF
choke) to V
VCO.
This gives a better match than a resistor and,
therefore, more output power. Additionally, a series inductor is
added after the dc bypass capacitor to provide a resonant LC
circuit. This tunes the oscillator output and provides approxi-
mately 10 dB additional rejection of the second harmonic. The
shunt inductor needs to be a relatively low value (<10 nH).
Alternatively, instead of the LC balun shown in Figure 21, both
outputs may be combined using a 180° rat-race coupler.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| EVAL-ADF4360-1EB1 | 制造商:Analog Devices 功能描述:Evaluation Board For ADF4360-1 |
| EVAL-ADF4360-1EBZ1 | 功能描述:BOARD EVALUATION FOR ADF4360-1 RoHS:是 類別:編程器，開發(fā)系統(tǒng) >> 評估演示板和套件 系列:- 產(chǎn)品培訓(xùn)模塊:Obsolescence Mitigation Program 標準包裝:1 系列:- 主要目的:電源管理，電池充電器 嵌入式:否 已用 IC / 零件:MAX8903A 主要屬性:1 芯鋰離子電池 次要屬性:狀態(tài) LED 已供物品:板 |
| EVAL-ADF4360-2EB1 | 制造商:Analog Devices 功能描述:EVALUATION BOARD FOR ADF4360-2 |
| EVAL-ADF4360-2EBZ1 | 功能描述:BOARD EVALUATION FOR ADF4360-2 RoHS:是 類別:編程器，開發(fā)系統(tǒng) >> 評估演示板和套件 系列:- 標準包裝:1 系列:PSoC® 主要目的:電源管理，熱管理 嵌入式:- 已用 IC / 零件:- 主要屬性:- 次要屬性:- 已供物品:板，CD，電源 |
| EVAL-ADF4360-3EB1 | 制造商:Analog Devices 功能描述:EVALUATION BOARD FOR ADF4360-3 |
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