Data Sheet
ADF4154
Rev. C | Page 5 of 24
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Rating
VDD to GND
0.3 V to +4 V
VDD to VDD
0.3 V to +0.3 V
VP to GND
0.3 V to +5.8 V
VP to VDD
0.3 V to +5.8 V
Digital I/O Voltage to GND
0.3 V to VDD + 0.3 V
Analog I/O Voltage to GND
0.3 V to VDD + 0.3 V
REFIN, RFIN to GND
0.3 V to VDD + 0.3 V
Operating Temperature Range
Industrial (B Version)
40°C to +85°C
Storage Temperature Range
65°C to +150°C
Maximum Junction Temperature
150°C
TSSOP θJA Thermal Impedance
112°C/W
LFCSP θJA Thermal Impedance
(Paddle Soldered)
30.4°C/W
Reflow Soldering
Peak Temperature
260°C
Time at Peak Temperature
40 sec
1
This device is a high performance RF-integrated circuit with an ESD rating of
<2 kV, and it is ESD sensitive. Proper precautions should be taken when
handling and assembling the device.
2
GND = AGND = DGND = 0 V.
3
VDD = AVDD = DVDD = SDVDD.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION