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參數(shù)資料
| 型號： | EV-ADF4108EB2Z |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 11/20頁 |
| 文件大?。?/td> | 0K |
| 描述： | BOARD EVAL FOR ADF4108EB2Z |
| 標準包裝： | 1 |
| 系列： | * |
Data Sheet
ADF4108
Rev. E | Page 19 of 20
PCB DESIGN GUIDELINES FOR CHIP SCALE PACKAGE
The lands on the chip scale package (CP-20-6) are rectangular.
The printed circuit board pad for these should be 0.1 mm longer
than the package land length and 0.05 mm wider than the package
land width. The land should be centered on the pad. This ensures
that the solder joint size is maximized. The bottom of the chip
scale package has a central thermal pad.
The thermal pad on the printed circuit board should be at least
as large as this exposed pad. On the printed circuit board, there
should be a clearance of at least 0.25 mm between the thermal
pad and the inner edges of the pad pattern. This ensures that
shorting is avoided.
Thermal vias can be used on the printed circuit board thermal
pad to improve thermal performance of the package. If vias are
used, they should be incorporated in the thermal pad at 1.2 mm
pitch grid. The via diameter should be between 0.3 mm and
0.33 mm and the via barrel should be plated with 1 oz. copper
to plug the via.
The user should connect the printed circuit board thermal pad
to AGND.
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| EV-ADF4153ASD1Z | 功能描述:時鐘和定時器開發(fā)工具 Evaluation Board RoHS:否 制造商:Texas Instruments 產(chǎn)品:Evaluation Modules 類型:Clock Conditioners 工具用于評估:LMK04100B 頻率:122.8 MHz 工作電源電壓:3.3 V |
| EV-ADF4153SD1Z | 功能描述:BOARD EVAL FOR ADF4153SD1Z RoHS:否 類別:編程器，開發(fā)系統(tǒng) >> 評估演示板和套件 系列:* 標準包裝:1 系列:- 主要目的:電信，線路接口單元（LIU） 嵌入式:- 已用 IC / 零件:IDT82V2081 主要屬性:T1/J1/E1 LIU 次要屬性:- 已供物品:板，電源，線纜，CD 其它名稱:82EBV2081 |
| EV-ADF4156SD1Z | 功能描述:BOARD EVAL FOR ADF4156 RoHS:是 類別:編程器，開發(fā)系統(tǒng) >> 評估演示板和套件 系列:- 標準包裝:1 系列:- 主要目的:電信，線路接口單元（LIU） 嵌入式:- 已用 IC / 零件:IDT82V2081 主要屬性:T1/J1/E1 LIU 次要屬性:- 已供物品:板，電源，線纜，CD 其它名稱:82EBV2081 |
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