Notes to tables: (1) Microparameters are timing delays contributed " />
參數(shù)資料
型號(hào)： EPF6016ATI100-2
廠商： Altera
文件頁數(shù)： 35/52頁
文件大?。?/td> 0K
描述： IC FLEX 6000 FPGA 16K 100-TQFP
產(chǎn)品培訓(xùn)模塊： Three Reasons to Use FPGA's in Industrial Designs
標(biāo)準(zhǔn)包裝： 270
系列： FLEX 6000
LAB/CLB數(shù)： 132
邏輯元件/單元數(shù)： 1320
輸入/輸出數(shù)： 81
門數(shù)： 16000
電源電壓： 3 V ~ 3.6 V
安裝類型： 表面貼裝
工作溫度： -40°C ~ 100°C
封裝/外殼： 100-TQFP
供應(yīng)商設(shè)備封裝： 100-TQFP（14x14）
40
Altera Corporation
FLEX 6000 Programmable Logic Device Family Data Sheet
Notes to tables:
(1)
Microparameters are timing delays contributed by individual architectural elements and cannot be measured
explicitly.
(2)
Operating conditions:
VCCIO = 5.0 V ±5% for commercial use in 5.0-V FLEX 6000 devices.
VCCIO = 5.0 V ±10% for industrial use in 5.0-V FLEX 6000 devices.
VCCIO = 3.3 V ±10% for commercial or industrial use in 3.3-V FLEX 6000 devices.
(3)
Operating conditions:
VCCIO = 3.3 V ±10% for commercial or industrial use in 5.0-V FLEX 6000 devices.
VCCIO = 2.5 V ±0.2 V for commercial or industrial use in 3.3-V FLEX 6000 devices.
(4)
Operating conditions:
VCCIO = 2.5 V, 3.3 V, or 5.0 V.
(5)
These parameters are worst-case values for typical applications. Post-compilation timing simulation and timing
analysis are required to determine actual worst-case performance.
(6)
This timing parameter shows the delay of a register-to-register test pattern and is used to determine speed grades.
There are 12 LEs, including source and destination registers. The row and column interconnects between the
registers vary in length.
(7)
This timing parameter is shown for reference and is specified by characterization.
(8)
This timing parameter is specified by characterization.
Tables 24 through 28 show the timing information for EPF6010A and
EPF6016A devices.
Table 23. External Timing Parameters
Symbol
Parameter
Conditions
tINSU
Setup time with global clock at LE register
tINH
Hold time with global clock at LE register
tOUTCO
Clock-to-output delay with global clock with LE register using FastFLEX I/O
pin
Table 24. LE Timing Microparameters for EPF6010A & EPF6016A Devices (Part 1 of 2)
Parameter
Speed Grade
Unit
-1
-2
-3
Min
Max
Min
Max
Min
Max
tREG_TO_REG
1.2
1.3
1.7
ns
tCASC_TO_REG
0.9
1.0
1.2
ns
tCARRY_TO_REG
0.9
1.0
1.2
ns
tDATA_TO_REG
1.1
1.2
1.5
ns
tCASC_TO_OUT
1.3
1.4
1.8
ns
tCARRY_TO_OUT
1.6
1.8
2.3
ns
tDATA_TO_OUT
1.7
2.0
2.5
ns
tREG_TO_OUT
0.4
0.5
ns
tSU
0.9
1.0
1.3
ns
tH
1.4
1.7
2.1
ns
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EPF6016ATI100-2N 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 6000 132 LABs 81 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF6016ATI144-2 制造商:Rochester Electronics LLC 功能描述:- Bulk
EPF6016ATI144-3 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 6000 132 LABs 117 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF6016ATI144-3N 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 6000 132 LABs 117 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF6016BC256-2 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 6000 132 LABs 204 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
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