參數(shù)資料
型號(hào)： EP7311-EV-C
廠商： CIRRUS LOGIC INC
元件分類： 微控制器/微處理器
英文描述： HIGH-PERFORMANCE, LOW-POWER SYSTEM-ON-CHIP WITH SDRAM AND ENHANCED DIGITAL AUDIO INTERFACE
中文描述： 32-BIT, 74 MHz, RISC MICROCONTROLLER, PQFP208
封裝： LQFP-208
文件頁(yè)數(shù)： 43/54頁(yè)
文件大?。?/td> 1533K
代理商： EP7311-EV-C
DS506PP1
Copyright Cirrus Logic, Inc. 2003
(All Rights Reserved)
43
EP7311
High-Performance, Low-Power System on Chip
256-Ball PBGA Ball Listing
Thelist is ordered by ball location.
Table V. 256-Ball PBGA Ball Listing
Ball Location
Name
Type
Description
A1
VDDIO
Pad power
Digital I/O power, 3.3V
A2
nCS[4]
O
Chip select out
A3
nCS[1]
O
Chip select out
A4
SDCLK
O
SDRAM clock out
A5
SDQM[3]
O
SDRAM byte lane mask
A6
DD[1]
O
LCD serial display data
A7
M
O
LCD AC bias drive
A8
VDDIO
Pad power
Digital I/O power, 3.3V
A9
D[0]
I/O
Data I/O
A10
D[2]
I/O
Data I/O
A11
A[3]
O
System byte address
A12
VDDIO
Pad power
Digital I/O power, 3.3V
A13
A[6]
O
System byte address
A14
MOSCOUT
O
Main oscillator out
A15
VDDOSC
Oscillator
power
Oscillator power in, 2.5V
A16
VSSIO
Pad ground
I/O ground
B1
nCS[5]
O
Chip select out
B2
VDDIO
Pad power
I/O ground
B3
nCS[3]
O
Chip select out
B4
nMOE/nSDCAS
O
ROM, expansion OP enable/SDRAM
CAS control signal
B5
VDDIO
Pad power
Digital I/O power, 3.3V
B6
nSDCS[1]
O
SDRAM chip select out
B7
DD[2]
O
LCD serial display data
B8
CL[1]
O
LCD line clock
B9
VDDCORE
Core power
Digital core power, 2.5V
B10
D[1]
I/O
Data I/O
B11
A[2]
O
System byte address
B12
A[4]
O
System byte address
B13
A[5]
O
System byte address
B14
WAKEUP
I
System wake up input
B15
VDDIO
Pad power
Digital I/O power, 3.3V
B16
nURESET
I
User reset input
C1
VDDIO
Pad power
Digital I/O power, 3.3V
C2
EXPCLK
I
Expansion clock input
C3
VSSIO
Pad ground
I/O ground
C4
VDDIO
Pad power
Digital I/O power, 3.3V
C5
VSSIO
Pad ground
I/O ground
C6
VSSIO
Pad ground
I/O ground
C7
VSSIO
Pad ground
I/O ground
C8
VDDIO
Pad power
Digital I/O power, 3.3V
C9
VSSIO
Pad ground
I/O ground
C10
VSSIO
Pad ground
I/O ground
C11
VSSIO
Pad ground
I/O ground
C12
VDDIO
Pad power
Digital I/O power, 3.3V
C13
VSSIO
Pad ground
I/O ground
C14
VSSIO
Pad ground
I/O ground
C15
nPOR
I
Power-on reset input
C16
nEXTPWR
I
External power supply sense input
D1
WRITE/nSDRAS
O
Transfer direction / SDRAM RAS signal
output
D2
EXPRDY
I
Expansion port ready input
D3
VSSIO
Pad ground
I/O ground
D4
VDDIO
Pad power
Digital I/O power, 3.3V
D5
nCS[2]
O
Chip select out
D6
nMWE/nSDWE
O
ROM, expansion write enable/ SDRAM
write enable control signal
D7
nSDCS[0]
O
SDRAM chip select out
D8
CL[2]
O
LCD pixel clock out
D9
VSSRTC
Core ground Real time clock ground
D10
D[4]
I/O
Data I/O
D11
nPWRFL
I
Power fail sense input
D12
MOSCIN
I
Main oscillator input
D13
VDDIO
Pad power
Digital I/O power, 3.3V
D14
VSSIO
Pad ground
I/O ground
D15
D[7]
I/O
Data I/O
D16
D[8]
I/O
Data I/O
E1
RXD[2]
I
UART 2 receive data input
E2
PB[7]
I
GPIO port B
E3
TDI
I
JTAG data input
E4
WORD
O
Word access select output
E5
VSSIO
Pad ground
I/O ground
E6
nCS[0]
O
Chip select out
E7
SDQM[2]
O
SDRAM byte lane mask
E8
FRM
O
LCD frame synchronization pulse
E9
A[0]
O
System byte address
E10
D[5]
I/O
Data I/O
E11
VSSOSC
Oscillator
ground
PLL ground
E12
VSSIO
Pad ground
I/O ground
E13
nMEDCHG/nBROM
I
Media change interrupt input / internal
ROM boot enable
E14
VDDIO
Pad power
Digital I/O power, 3.3V
E15
D[9]
I/O
Data I/O
E16
D[10]
I/O
Data I/O
F1
PB[5]
I
GPIO port B
F2
PB[3]
I
GPIO port B
F3
VSSIO
Pad ground
I/O ground
F4
TXD[2]
O
UART 2 transmit data output
F5
RUN/CLKEN
O
Run output / clock enable output
F6
VSSIO
Pad ground
I/O ground
Table V. 256-Ball PBGA Ball Listing (Continued)
Ball Location
Name
Type
Description
相關(guān)PDF資料
PDF描述
EP7311-IB-C HIGH-PERFORMANCE, LOW-POWER SYSTEM-ON-CHIP WITH SDRAM AND ENHANCED DIGITAL AUDIO INTERFACE
EP7311-IV-C HIGH-PERFORMANCE, LOW-POWER SYSTEM-ON-CHIP WITH SDRAM AND ENHANCED DIGITAL AUDIO INTERFACE
EP7311-IR-C HIGH-PERFORMANCE, LOW-POWER SYSTEM-ON-CHIP WITH SDRAM AND ENHANCED DIGITAL AUDIO INTERFACE
EP7312-EV-90 HIGH-PERFORMANCE, LOW-POWER SYSTEM ON CHIP WITH SDRAM AND ENHANCED DIGITAL AUDIO INTERFACE
EP7312-EV-C HIGH-PERFORMANCE, LOW-POWER SYSTEM-ON-CHIP WITH SDRAM AND ENHANCED DIGITAL AUDIO INTERFACE
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EP7311-IB 功能描述:音頻片上系統(tǒng) - SoC IC Ultra Low PWR Hi Perf SOC w/LCD RoHS:否 制造商:Cirrus Logic
EP7311-IB-90 功能描述:音頻片上系統(tǒng) - SoC IC Ultra Low PWR Hi Perf SOC w/LCD RoHS:否 制造商:Cirrus Logic
EP7311-IB-C 制造商:CIRRUS 制造商全稱:Cirrus Logic 功能描述:HIGH-PERFORMANCE, LOW-POWER SYSTEM-ON-CHIP WITH SDRAM AND ENHANCED DIGITAL AUDIO INTERFACE
EP7311-IBZ 制造商:Cirrus Logic 功能描述:IC, 32BIT MCU, ARM7, 74MHZ, BGA-256, Controller Family/Series:(ARM7), Core Size:
EP7311-IR 功能描述:IC ARM720T MCU 74MHZ 204-TFBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:EP7 標(biāo)準(zhǔn)包裝:1,500 系列:AVR® ATtiny 核心處理器:AVR 芯體尺寸:8-位 速度:16MHz 連通性:I²C，LIN，SPI，UART/USART，USI 外圍設(shè)備:欠壓檢測(cè)/復(fù)位，POR，PWM，溫度傳感器，WDT 輸入/輸出數(shù):16 程序存儲(chǔ)器容量:8KB（4K x 16） 程序存儲(chǔ)器類型:閃存 EEPROM 大小:512 x 8 RAM 容量:512 x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 11x10b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 125°C 封裝/外殼:20-SOIC（0.295"，7.50mm 寬） 包裝:帶卷 (TR)
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*