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參數(shù)資料
| 型號： | EP1K10QC208-2 |
| 廠商： | Altera |
| 文件頁數(shù)： | 45/86頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC ACEX 1K FPGA 10K 208-PQFP |
| 產(chǎn)品培訓(xùn)模塊： | Three Reasons to Use FPGA's in Industrial Designs |
| 標(biāo)準(zhǔn)包裝： | 144 |
| 系列： | ACEX-1K® |
| LAB/CLB數(shù)： | 72 |
| 邏輯元件/單元數(shù)： | 576 |
| RAM 位總計： | 12288 |
| 輸入/輸出數(shù)： | 120 |
| 門數(shù)： | 56000 |
| 電源電壓： | 2.375 V ~ 2.625 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | 0°C ~ 70°C |
| 封裝/外殼： | 208-BFQFP |
| 供應(yīng)商設(shè)備封裝： | 208-PQFP（28x28） |
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Altera Corporation
5
ACEX 1K Programmable Logic Device Family Data Sheet
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13
To
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Table 5 shows ACEX 1K device performance for more complex designs.
These designs are available as Altera MegaCoreTM functions.
Each ACEX 1K device contains an embedded array and a logic array. The
embedded array is used to implement a variety of memory functions or
complex logic functions, such as digital signal processing (DSP), wide
data-path manipulation, microcontroller applications, and data-
transformation functions. The logic array performs the same function as
the sea-of-gates in the gate array and is used to implement general logic
such as counters, adders, state machines, and multiplexers. The
combination of embedded and logic arrays provides the high
performance and high density of embedded gate arrays, enabling
designers to implement an entire system on a single device.
ACEX 1K devices are configured at system power-up with data stored in
an Altera serial configuration device or provided by a system controller.
Altera offers EPC16, EPC2, EPC1, and EPC1441 configuration devices,
which configure ACEX 1K devices via a serial data stream. Configuration
data can also be downloaded from system RAM or via the Altera
MasterBlasterTM, ByteBlasterMVTM, or BitBlasterTM download cables. After
an ACEX 1K device has been configured, it can be reconfigured in-circuit
by resetting the device and loading new data. Because reconfiguration
requires less than 40 ms, real-time changes can be made during system
operation.
ACEX 1K devices contain an interface that permits microprocessors to
configure ACEX 1K devices serially or in parallel, and synchronously or
asynchronously. The interface also enables microprocessors to treat an
ACEX 1K device as memory and configure it by writing to a virtual
memory location, simplifying device reconfiguration.
Table 5. ACEX 1K Device Performance for Complex Designs
Application
LEs
Used
Performance
Speed Grade
Units
-1
-2
-3
16-bit, 8-tap parallel finite impulse response (FIR)
filter
597
192
156
116
MSPS
8-bit, 512-point Fast Fourier transform (FFT)
function
1,854
23.4
28.7
38.9
s
113
92
68
MHz
a16450
universal asynchronous
receiver/transmitter (UART)
342
36
28
20.5
MHz
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| EP1K10QC208-2N | 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - ACEX 1K 72 LABs 120 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256 |
| EP1K10QC208-3 | 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - ACEX 1K 72 LABs 120 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256 |
| EP1K10QC208-3N | 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - ACEX 1K 72 LABs 120 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256 |
| EP1K10TC100-1 | 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - ACEX 1K 72 LABs 66 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256 |
| EP1K10TC100-1N | 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - ACEX 1K 72 LABs 66 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256 |
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