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參數(shù)資料
| 型號： | EFM32G890F64 |
| 廠商： | Energy Micro |
| 文件頁數(shù)： | 65/71頁 |
| 文件大?。?/td> | 0K |
| 描述： | MCU 32BIT 64KB FLASH 112-BGA |
| 標(biāo)準(zhǔn)包裝： | 1,000 |
| 系列： | Gecko |
| 核心處理器： | ARM? Cortex?-M3 |
| 芯體尺寸： | 32-位 |
| 速度： | 32MHz |
| 連通性： | EBI/EMI，I²C，IrDA，智能卡，SPI，UART/USART |
| 外圍設(shè)備： | 欠壓檢測/復(fù)位，DMA，LCD，POR，PWM，WDT |
| 輸入/輸出數(shù)： | 90 |
| 程序存儲器容量： | 64KB（64K x 8） |
| 程序存儲器類型： | 閃存 |
| RAM 容量： | 16K x 8 |
| 電壓 - 電源 (Vcc/Vdd)： | 1.8 V ~ 3.8 V |
| 數(shù)據(jù)轉(zhuǎn)換器： | A/D 8x12b，D/A 2x12b |
| 振蕩器型： | 外部 |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 112-LFBGA |
| 包裝： | 帶卷 (TR) |
| 其它名稱： | EFM32G890F64-BGA112 |
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...the world's most energy friendly microcontrollers
2013-06-28 - EFM32G890FXX - d0010_Rev1.60
68
www.energymicro.com
List of Figures
2.1. Block Diagram ....................................................................................................................................... 3
2.2. EFM32G890 Memory Map with largest RAM and Flash sizes .......................................................................... 8
28MHz ..................................................................................................................................................... 12
21MHz ..................................................................................................................................................... 12
14MHz ..................................................................................................................................................... 13
11MHz ..................................................................................................................................................... 13
7MHz ....................................................................................................................................................... 14
3.6. EM1 Current consumption with all peripheral clocks disabled and HFRCO running at 28MHz ............................... 14
3.7. EM1 Current consumption with all peripheral clocks disabled and HFRCO running at 21MHz ............................... 15
3.8. EM1 Current consumption with all peripheral clocks disabled and HFRCO running at 14MHz ............................... 15
3.9. EM1 Current consumption with all peripheral clocks disabled and HFRCO running at 11MHz ............................... 16
3.10. EM1 Current consumption with all peripheral clocks disabled and HFRCO running at 7MHz ............................... 16
3.11. EM2 current consumption. RTC prescaled to 1kHz, 32 kHz LFRCO. ............................................................. 17
3.12. EM3 current consumption. ................................................................................................................... 17
3.13. EM4 current consumption. ................................................................................................................... 18
3.14. Typical Low-Level Output Current, 2V Supply Voltage ................................................................................ 21
3.15. Typical High-Level Output Current, 2V Supply Voltage ................................................................................ 22
3.16. Typical Low-Level Output Current, 3V Supply Voltage ................................................................................ 23
3.17. Typical High-Level Output Current, 3V Supply Voltage ................................................................................ 24
3.18. Typical Low-Level Output Current, 3.8V Supply Voltage .............................................................................. 25
3.19. Typical High-Level Output Current, 3.8V Supply Voltage ............................................................................. 26
3.20. Calibrated LFRCO Frequency vs Temperature and Supply Voltage .............................................................. 29
3.21. Calibrated HFRCO 11 MHz Band Frequency vs Temperature and Supply Voltage ........................................... 31
3.22. Calibrated HFRCO 14 MHz Band Frequency vs Temperature and Supply Voltage ........................................... 31
3.23. Calibrated HFRCO 21 MHz Band Frequency vs Temperature and Supply Voltage ........................................... 31
3.24. Calibrated HFRCO 28 MHz Band Frequency vs Temperature and Supply Voltage ........................................... 32
3.25. Integral Non-Linearity (INL) ................................................................................................................... 36
3.26. Differential Non-Linearity (DNL) .............................................................................................................. 37
3.27. ADC Frequency Spectrum, Vdd = 3V, Temp = 25° ................................................................................... 38
3.28. ADC Integral Linearity Error vs Code, Vdd = 3V, Temp = 25° ..................................................................... 39
3.29. ADC Differential Linearity Error vs Code, Vdd = 3V, Temp = 25° ................................................................. 40
3.30. ADC Absolute Offset, Common Mode = Vdd /2 ........................................................................................ 41
3.31. ADC Dynamic Performance vs Temperature for all ADC References, Vdd = 3V .............................................. 41
3.32. Typical ACMP Characteristics ............................................................................................................... 44
4.1. EFM32G890 Pinout (top view, not to scale) ............................................................................................... 48
4.2. BGA112 .............................................................................................................................................. 57
5.1. BGA112 PCB Land Pattern ..................................................................................................................... 58
5.2. BGA112 PCB Solder Mask ..................................................................................................................... 59
5.3. BGA112 PCB Stencil Design ................................................................................................................... 60
6.1. Example Chip Marking ........................................................................................................................... 61
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| EFM32G890F64-BGA112 | 制造商:Energy Micro AS 功能描述:MCU, 64K FLASH, LCD 4X40, USART+UART 3+1, BGA112 - Tape and Reel 制造商:Energy Micro AS 功能描述:IC MCU 32BIT 64KB FLASH 112BGA |
| EFM32G890F64-BGA112T | 制造商:Energy Micro AS 功能描述:32 BIT ARM MPU, GECKO - Trays |
| EFM32G890F64-BGA112-T | 制造商:Energy Micro AS 功能描述:IC MCU 32BIT 64KB FLASH 112BGA |
| EFM32G890F64-T | 制造商:Energy Micro AS 功能描述:IC MCU 32BIT 64KB FLASH 112BGA |
| EFM32-G890-SK-F128 | 制造商:Energy Micro AS 功能描述:MCU CORTEX-M3 EFM32-G890 SAMPLE-PK 制造商:Energy Micro AS 功能描述:MCU, CORTEX-M3, EFM32-G890 SAMPLE-PK 制造商:Silicon Laboratories Inc 功能描述:MCU, CORTEX-M3, EFM32-G890 SAMPLE-PK |
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