參數(shù)資料
型號: EFM32G890F64
廠商: Energy Micro
文件頁數(shù): 59/71頁
文件大?。?/td> 0K
描述: MCU 32BIT 64KB FLASH 112-BGA
標準包裝: 1,000
系列: Gecko
核心處理器: ARM? Cortex?-M3
芯體尺寸: 32-位
速度: 32MHz
連通性: EBI/EMI,I²C,IrDA,智能卡,SPI,UART/USART
外圍設備: 欠壓檢測/復位,DMA,LCD,POR,PWM,WDT
輸入/輸出數(shù): 90
程序存儲器容量: 64KB(64K x 8)
程序存儲器類型: 閃存
RAM 容量: 16K x 8
電壓 - 電源 (Vcc/Vdd): 1.8 V ~ 3.8 V
數(shù)據(jù)轉換器: A/D 8x12b,D/A 2x12b
振蕩器型: 外部
工作溫度: -40°C ~ 85°C
封裝/外殼: 112-LFBGA
包裝: 帶卷 (TR)
其它名稱: EFM32G890F64-BGA112
...the world's most energy friendly microcontrollers
2013-06-28 - EFM32G890FXX - d0010_Rev1.60
62
www.energymicro.com
7 Revision History
7.1 Revision 1.60
June 28th, 2013
Updated PCB Land Pattern, PCB Solder Mask and PCB Stencil Design figures.
Updated power requirements in the Power Management section.
Removed minimum load capacitance figure and table. Added reference to application note.
Other minor corrections.
7.2 Revision 1.50
September 11th, 2012
Updated the HFRCO 1 MHz band typical value to 1.2 MHz.
Updated the HFRCO 7 MHz band typical value to 6.6 MHz.
Corrected BGA solder balls material from Sn96.5/Ag3/Cu0.5 to SAC105.
Other minor corrections.
7.3 Revision 1.40
February 27th, 2012
Updated Power Management section.
Corrected operating voltage from 1.8 V to 1.85 V.
Corrected TGRADADCTH parameter.
Corrected BGA112 package drawing.
Updated PCB land pattern, solder mask and stencil design.
7.4 Revision 1.30
May 20th, 2011
Updated LFXO load capacitance section.
7.5 Revision 1.20
December 17th, 2010
Increased max storage temperature.
Added data for <150°C and <70°C on Flash data retention.
Changed latch-up sensitivity test description.
Added IO leakage current.
Added Flash current consumption.
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