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參數(shù)資料
| 型號(hào)： | E6420-EDGE6420 |
| 英文描述： | Per-Pin Electronics Companion DAC |
| 中文描述： | 按針腳電子伴侶援 |
| 文件頁(yè)數(shù)： | 10/29頁(yè) |
| 文件大?。?/td> | 244K |
| 代理商： | E6420-EDGE6420 |
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18
2000 Semtech Corp.
www .semtech.com
HIGH-PERFORMANCE PRODUCTS – ATE
Edge6420
Package Information (continued)
15 14 13 12 11 10 987654321
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
D
D2
E
(E1)
(D1)
E2
–A–
–B–
0.10
Detail B
Detail A
4
NX
φ0.15 M C A M B M
φ b
φ0.075 M C
f
e
f
SEATING
PLANE
5
6
// bbb C
aaa C
// ccc C
A2
A1
A
c
–C–
TOP VIEW
BOTTOM VIEW
SIDE VIEW
DETAIL B
DETAIL A
Edge6420BBG Package
S
E
C
N
E
R
E
F
E
R
L
A
N
O
I
S
N
E
M
I
D
F
E
RN
I
MM
O
NX
A
M
A6
9
.
06
0
.
16
1
.
1
A1
2
.
06
2
.
01
3
.
0
2
A0
5
.
05
5
.
00
6
.
0
1
DC
S
B
0
2
.
1
2
D0
9
.
2
10
0
.
3
10
1
.
3
1
E0
9
.
2
10
0
.
3
10
1
.
3
1
EC
S
B
0
2
.
1
2
E0
9
.
2
10
0
.
3
10
1
.
3
1
b0
4
.
05
4
.
05
5
.
0
c5
2
.
0
a
a2
1
.
0
b
b0
2
.
0
c
c0
2
.
0
e8
.
0
f0
8
.
00
9
.
00
0
.
1
M5
1
N5
2
NOTES:
1.
All dimensions are in millimeters.
2.
‘e’ represents the basic solder ball grid pitch.
3.
“M” represents the basic solder ball matrix size, and symbol “N” is the number
of balls after depopulating.
4.
‘b’ is measurable at the maximum solder ball dimaeter after reflow parallel
to primary datum –C–.
5.
Dimension ‘a(chǎn)aa’ is measured parallel to primary datum –C–.
6.
Primary datum –C– and seating plane are defined by the spherical crowns of the
solder balls.
7.
Package surface shall be matte finish charmilles 24 to 27.
8.
Package centering to substrate shall be 0.0780 mm maximum for both X and Y
directions respectively.
9.
Package warp shall be 0.050 mm maximum.
10.
Substrate material base is BT resin.
11.
The overall package thickness “A” already considers collapse balls.
12.
Dimensioning and tolerancing per ASME Y14.5M 1994.
NOTE: The inner 9x9 balls are for improved thermal dissipation.
They will be at the VEE potential, so board layout should ensure
that these inner balls are connected to the VEE plane.
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