參數(shù)資料
型號(hào)： DSP56F807
廠商： 飛思卡爾半導(dǎo)體(中國(guó))有限公司
英文描述： 16-bit Hybrid Controller(16位混合控制器)
中文描述： 16位混合控制器（16位混合控制器）
文件頁(yè)數(shù)： 17/52頁(yè)
文件大小： 1124K
代理商： DSP56F807
General Characteristics
56F807 Technical Data
17
Notes:
1.
Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application.
Determined on 2s2p thermal test board.
Junction to ambient thermal resistance, Theta-JA (
R
θ
JA
) was simulated to be equivalent to the
JEDEC specification JESD51-2 in a horizontal configuration in natural convection. Theta-JA was
also simulated on a thermal test board with two internal planes (2s2p where “s” is the number of
signal layers and “p” is the number of planes) per JESD51-6 and JESD51-7. The correct name for
Theta-JA for forced convection or with the non-single layer boards is Theta-JMA.
Junction to case thermal resistance, Theta-JC (R
θ
JC
), was simulated to be equivalent to the measured
values using the cold plate technique with the cold plate temperature used as the “case” temperature.
The basic cold plate measurement technique is described by MIL-STD 883D, Method 1012.1. This
is the correct thermal metric to use to calculate thermal performance when the package is being used
with a heat sink.
Thermal Characterization Parameter, Psi-JT (
Ψ
JT
), is the “resistance” from junction to reference
point thermocouple on top center of case as defined in JESD51-2.
Ψ
JT
is a useful value to use to
estimate junction temperature in steady state customer environments.
Junction temperature is a function of on-chip power dissipation, package thermal resistance,
mounting site (board) temperature, ambient temperature, air flow, power dissipation of other
components on the board, and board thermal resistance.
See Section 5.1 from more details on thermal design considerations.
2.
3.
4.
5.
6.
Table 22. Thermal Characteristics
6
Characteristic
Comments
Symbol
Value
Unit
Notes
160-pin
LQFP
160
MBGA
Junction to ambient
Natural convection
R
θ
JA
38.5
63.4
°C/W
2
Junction to ambient (@1m/sec)
R
θ
JMA
35.4
60.3
°C/W
2
Junction to ambient
Natural convection
Four layer
board (2s2p)
R
θ
JMA
(2s2p)
33
49.9
°C/W
1,2
Junction to ambient (@1m/sec)
Four layer
board (2s2p)
R
θ
JMA
31.5
46.8
°C/W
1,2
Junction to case
R
θ
JC
8.6
8.1
°C/W
3
Junction to center of case
Ψ
JT
0.8
0.6
°C/W
4, 5
I/O pin power dissipation
P
I/O
User Determined
W
Power dissipation
P
D
P
D
= (I
DD
x V
DD
+ P
I/O
)
W
Junction to center of case
P
DMAX
(TJ - TA) /
θ
JA
°C
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
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