參數(shù)資料
型號(hào)： DSP56321VF240
廠商： 飛思卡爾半導(dǎo)體(中國(guó))有限公司
元件分類： 數(shù)字信號(hào)處理
英文描述： 24-Bit Digital Signal Processor
中文描述： 24位數(shù)字信號(hào)處理器
文件頁數(shù)： 61/84頁
文件大?。?/td> 898K
代理商： DSP56321VF240
DSP56321 Technical Data, Rev. 11
Freescale Semiconductor
4-1
Design Considerations
4
This section describes various areas to consider when incorporating the DSP56321 device into a system design.
4.1 Thermal Design Considerations
An estimate of the chip junction temperature, T
J
, in
°
C can be obtained from this equation:
Equation 1:
T
J
T
A
P
D
R
θ
JA
+
=
Where:
T
A
R
θ
JA
P
D
=
=
=
ambient temperature °C
package junction-to-ambient thermal resistance °C/W
power dissipation in package
Historically, thermal resistance has been expressed as the sum of a junction-to-case thermal resistance and a case-
to-ambient thermal resistance, as in this equation:
Equation 2:
Where:
R
θ
JA
R
θ
JC
R
θ
CA
=
=
=
package junction-to-ambient thermal resistance °C/W
package junction-to-case thermal resistance °C/W
package case-to-ambient thermal resistance °C/W
R
θ
JC
is device-related and cannot be influenced by the user. The user controls the thermal environment to change
the case-to-ambient thermal resistance, R
θ
CA
. For example, the user can change the air flow around the device, add
a heat sink, change the mounting arrangement on the printed circuit board (PCB) or otherwise change the thermal
dissipation capability of the area surrounding the device on a PCB. This model is most useful for ceramic packages
with heat sinks; some 90 percent of the heat flow is dissipated through the case to the heat sink and out to the
ambient environment. For ceramic packages, in situations where the heat flow is split between a path to the case
and an alternate path through the PCB, analysis of the device thermal performance may need the additional
modeling capability of a system-level thermal simulation tool.
The thermal performance of plastic packages is more dependent on the temperature of the PCB to which the
package is mounted. Again, if the estimates obtained from R
θ
JA
do not satisfactorily answer whether the thermal
performance is adequate, a system-level model may be appropriate.
A complicating factor is the existence of three common ways to determine the junction-to-case thermal resistance
in plastic packages.
To minimize temperature variation across the surface, the thermal resistance is measured from the junction
to the outside surface of the package (case) closest to the chip mounting area when that surface has a
proper heat sink.
×
(
)
R
θ
JA
R
θ
JC
R
θ
CA
+
=
相關(guān)PDF資料
PDF描述
DSP56321VF275 24-Bit Digital Signal Processor
DSP56321VL200 24-Bit Digital Signal Processor
DSP56321VL220 24-Bit Digital Signal Processor
DSP56321VL240 24-Bit Digital Signal Processor
DSP56321VL275 24-Bit Digital Signal Processor
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DSP56321VF275 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 275Mhz/550MMACS 275Mhz EFCOP RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
DSP56321VL200 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 24 BIT DSP PBFREE RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
DSP56321VL200R2 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 24 BIT DSP PBFREE RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
DSP56321VL220 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 24 BIT DSP PBFREE RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
DSP56321VL240 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 24 BIT DSP PBFREE RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
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