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參數(shù)資料
| 型號： | DS3234S#T&R |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 12/21頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC RTC W/TCXO 20-SOIC |
| 產(chǎn)品培訓(xùn)模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標(biāo)準(zhǔn)包裝： | 1,000 |
| 類型： | 時鐘/日歷 |
| 特點： | 警報器，閏年，NVSRAM，方波輸出，TCXO/晶體 |
| 存儲容量： | 256B |
| 時間格式： | HH:MM:SS（12/24 小時） |
| 數(shù)據(jù)格式： | YY-MM-DD-dd |
| 接口： | SPI |
| 電源電壓： | 2 V ~ 5.5 V |
| 電壓 - 電源，電池： | 2 V ~ 3.8 V |
| 工作溫度： | 0°C ~ 70°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 20-SOIC（0.295"，7.50mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 20-SOIC W |
| 包裝： | 帶卷 (TR) |
DS3234
Extremely Accurate SPI Bus RTC with
Integrated Crystal and SRAM
2
_____________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
RECOMMENDED OPERATING CONDITIONS
(TA = -40°C to +85°C, unless otherwise noted.) (Notes 2, 3)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Voltage Range on Any Pin Relative to Ground......-0.3V to +6.0V
Junction-to-Ambient Thermal Resistance (
θJA) (Note 1) ...55°C/W
Junction-to-Case Thermal Resistance (
θJC) (Note 1) ........24°C/W
Operating Temperature Range
(noncondensing) .............................................-40°C to +85°C
Junction Temperature ......................................................+125°C
Storage Temperature Range ...............................-40°C to +85°C
Lead Temperature (soldering, 10s) .................................+260°C
Soldering Temperature (reflow, 2 times max) ....................+260°C
(See the
Handling, PC Board Layout, and Assembly section.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
VCC
2.0
3.3
5.5
Supply Voltage
VBAT
2.0
3.0
3.8
V
Logic 1 Input
CS, SCLK, DIN
VIH
0.7 x
VCC
VCC +
0.3
V
2.0V
VCC
3.63V
-0.3
+0.2 x
VCC
Logic 0 Input
CS, SCLK, DIN,
RST
VIL
3.63V < VCC
5.5V
-0.3
+0.7
V
ELECTRICAL CHARACTERISTICS
(VCC = 2.0V to 5.5V, VCC = active supply (see Table 1), TA = -40°C to +85°C, unless otherwise noted.) (Typical values are at VCC =
3.3V, VBAT = 3.0V, and TA = +25°C, unless otherwise noted. TCXO operation guaranteed from 2.3V to 5.5V on VCC and 2.3V to 3.8V on
VBAT.) (Notes 2, 3)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
VCC = 3.63V
400
Active Supply Current
ICCA
SCLK = 4MHz, BSY = 0
(Notes 4, 5)
VCC = 5.5V
700
A
VCC = 3.63V
120
Standby Supply Current
ICCS
CS = VIH, 32kHz output off,
SQW output off
(Note 5)
VCC = 5.5V
160
A
VCC = 3.63V
500
Temperature Conversion Current
ICCSCONV
SPI bus inactive, 32kHz
output off, SQW output off
VCC = 5.5V
600
A
Power-Fail Voltage
VPF
2.45
2.575
2.70
V
VBAT Leakage Current
IBATLKG
25
100
nA
(VCC = 2.0V to 5.5V, TA = -40°C to +85°C, unless otherwise noted.) (Notes 2 and 3)
Logic 1 Output, 32kHz
IOH = -500A
IOH = -250A
IOH = -125A
VOH
VCC > 3.63V,
3.63V > VCC > 2.7V,
2.7V > (VCC or VBAT) > 2.0V
(BB32kHz = 1)
0.85 x VCC
V
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
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