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參數(shù)資料
| 型號： | DS229N |
| 廠商： | DALLAS SEMICONDUCTOR |
| 元件分類： | Line Driver or Receiver |
| 英文描述： | LINE TRANSCEIVER, PDIP20 |
| 封裝： | DIP-20 |
| 文件頁數(shù)： | 12/29頁 |
| 文件大?。?/td> | 1710K |
| 代理商： | DS229N |
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MAX14640–MAX14644/MAX14651
USB Host Adapter Emulators
2
Maxim Integrated
(All voltages referenced to GND.)
VCC, TDP, TDM, DP, DM, SDA, SCL,
CB0, CB1, CEN, CEN, INT..................................-0.3V to +6V
Continuous Current into Any Terminal ............................ Q30mA
Continuous Power Dissipation (TA = +70NC)
TDFN (derate 11.9mW/NC above +70NC).................953.5mW
Operating Temperature Range.......................... -40NC to +85NC
Junction Temperature .....................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
TDFN
Junction-to-Ambient Thermal Resistance (BJA) .......83.9NC/W
Junction-to-Case Thermal Resistance (BJC) ...............37NC/W
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
ELECTRICAL CHARACTERISTICS
(VCC = 3.0V to 5.5V, TA = -40NC to +85NC, unless otherwise noted. Typical values are at VCC = 5.0V and TA = +25NC.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
POWER SUPPLY
VCC Supply Voltage
VCC
CB0 = high
3.0
5.5
V
CB0 = low (Note 3)
4.75
5.25
VCC Supply Current
ICC
MAX14641–
MAX14644
CB1 = CB0 = low (AM2
mode)
200
F
A
CB1 = CB0 = high (CM
mode)
100
CB1 = low, CB0 = high
(PM mode)
20
MAX14640/
MAX14651
MODE_SEL[2:0] = 000
(AM2 mode)
200
MODE_SEL[2:0] = 011
(CM mode)
100
MODE_SEL[2:0] = 001
(PM mode)
20
POR Delay
tPOR
50
ms
ANALOG SWITCHES (DP, DM, TDP, TDM)
Analog Signal Range
VDP, VDM (Note 4)
0
VCC
V
TDP/TDM On Resistance
RON
VIN = 0V to VCC, IIN = 10mA
3.5
6.5
I
TDP/TDM On-Resistance
Matching Between Channels
D
RON
VCC = 5.0V, IIN = 10mA, VIN = 0.4V
0.1
I
TDP/TDM On-Resistance
Flatness
RFLAT
VCC = 5.0V, IIN = 10mA, VIN = 0V to VCC
0.1
I
DP/DM Short On-Resistance
RSHORT
VDP = 1V, RL = 20kI on DM
70
128
I
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| DS229N+ | 功能描述:RS-232接口集成電路 RoHS:否 制造商:Exar 數(shù)據(jù)速率:52 Mbps 工作電源電壓:5 V 電源電流:300 mA 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:LQFP-100 封裝: |
| DS229S | 功能描述:RS-232接口集成電路 RoHS:否 制造商:Exar 數(shù)據(jù)速率:52 Mbps 工作電源電壓:5 V 電源電流:300 mA 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:LQFP-100 封裝: |
| DS229S/T&R | 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述:IC TXRX TRI 5V RS-232 IND 20SOIC |
| DS229S/T&R/ | 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述: |
| DS229S/T&R | 功能描述:RS-232接口集成電路 RoHS:否 制造商:Exar 數(shù)據(jù)速率:52 Mbps 工作電源電壓:5 V 電源電流:300 mA 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:LQFP-100 封裝: |
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