參數(shù)資料
型號： DS21552L
廠商： Maxim Integrated Products
文件頁數(shù)： 83/137頁
文件大?。?/td> 0K
描述： IC TXRX T1 1-CHIP 5V 100-LQFP
產(chǎn)品培訓(xùn)模塊： Lead (SnPb) Finish for COTS
產(chǎn)品變化通告： Product Discontinuation 20/Feb/2012
標(biāo)準(zhǔn)包裝： 90
功能： 單芯片收發(fā)器
接口： E1，HDLC，J1，T1
電路數(shù)： 1
電源電壓： 4.75 V ~ 5.25 V
電流 - 電源： 75mA
工作溫度： 0°C ~ 70°C
安裝類型： 表面貼裝
封裝/外殼： 100-LQFP
供應(yīng)商設(shè)備封裝： 100-LQFP（14x14）
包裝： 托盤
包括： DSX-1 和 CSU 線路補償發(fā)生器，HDLC 控制器，帶內(nèi)回路代碼發(fā)生器和檢測器
DS21352/DS21552
5 of 137
1. LIST OF FIGURES
Figure 3-1 SCT BLOCK DIAGRAM.........................................................................................................9
Figure 16-1 EXTERNAL ANALOG CONNECTIONS ..........................................................................87
Figure 16-2 OPTIONAL CRYSTAL CONNECTIONS ..........................................................................88
Figure 16-3 TRANSMIT WAVEFORM TEMPLANE............................................................................89
Figure 16-4 JITTER TOLERANCE.........................................................................................................91
Figure 16-5 JITTER ATTENUATION ....................................................................................................91
Figure 16-6 PROTECTED INTERFACE EXAMPLE FOR THE DS21552...........................................93
Figure 16-7 PROTECTED INTERFACE EXAMPLE FOR TE DS21352..............................................94
Figure 16-8 TYPICAL MONITOR PORT APPLICATION....................................................................95
Figure 19-1 JTAG FUNCTIONAL BLOCK DIAGRAM......................................................................100
Figure 19-2 TAP CONTROLLER STATE DIAGRAM ........................................................................103
Figure 20-1 IBO BASIC CONFIGURATION USING 4 SCTS ............................................................110
Figure 21-1 RECEIVE SIDE D4 TIMING.............................................................................................111
Figure 21-2 RECEIVE SIDE ESF TIMING...........................................................................................112
Figure 21-3 RECEIVE SIDE BOUNDARY TIMING (with elastic store disabled)..............................113
Figure 21-4 RECEIVE SIDE 1.544 MHz BOUNDARY TIMING (with elastic store enabled) ...........113
Figure 21-5 RECEIVE SIDE 2.048 MHz BOUNDARY TIMING (with elastic store enabled) ...........114
Figure 21-6 RECEIVE SIDE INTERLEAVE BUS OPERATION, BYTE MODE ..............................115
Figure 21-7 RECEIVE SIDE INTERLEAVE BUS OPERATION, FRAME MODE...........................116
Figure 21-8 TRANSMIT SIDE D4 TIMING.........................................................................................117
Figure 21-9 TRANSMIT SIDE ESF TIMING.......................................................................................118
Figure 21-10 TRANSMIT SIDE BOUNDARY TIMING (with elastic store disabled) ........................119
Figure 21-11 TRANSMIT SIDE 1.544 MHz BOUNDARY TIMING (with elastic store enabled)......119
Figure 21-12 TRANSMIT SIDE 2.048 MHz BOUNDARY TIMING (with elastic store enabled)......120
Figure 21-13 TRANSMIT SIDE INTERLEAVE BUS OPERATION, BYTE MODE.........................121
Figure 21-14 TRANSMIT SIDE INTERLEAVE BUS OPERATION, FRAME MODE .....................122
Figure 22-1 RECEIVE DATA FLOW ...................................................................................................123
Figure 22-2 TRANSMIT DATA FLOW................................................................................................124
Figure 24-1 INTEL BUS READ TIMING (BTS=0 / MUX=1) .............................................................127
Figure 24-2 INTEL BUS WRITE TIMING (BTS=0 / MUX=1) ...........................................................127
Figure 24-3 MOTOROLA BUS TIMING (BTS=1 / MUX=1)..............................................................128
Figure 24-4 INTEL BUS READ TIMING (BTS=0 / MUX=0) ..............................................................130
Figure 24-5 INTEL BUS READ TIMING (BTS=0 / MUX=0) .............................................................130
Figure 24-6 MOTOROLA BUS READ TIMING (BTS=1 / MUX=0)..................................................131
Figure 24-7 MOTOROLA BUS READ TIMING (BTS=1 / MUX=0)..................................................131
Figure 24-8 RECEIVE SIDE TIMING ..................................................................................................133
Figure 24-9 RECEIVE SIDE TIMING, ELASTIC STORE ENABLED...............................................134
Figure 24-10 RECEIVE LINE INTERFACE TIMING .........................................................................135
Figure 24-11 TRANSMIT SIDE TIMING.............................................................................................137
Figure 24-12 TRANSMIT SIDE TIMING, ELASTIC STORE ENABLED .........................................138
Figure 24-13 TRANSMIT LINE INTERFACE TIMING......................................................................138
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DS21552L+ 功能描述:網(wǎng)絡(luò)控制器與處理器 IC 5V T1 Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS21552LB 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述:
DS21552LN 功能描述:網(wǎng)絡(luò)控制器與處理器 IC 5V T1 Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS21552LN+ 功能描述:網(wǎng)絡(luò)控制器與處理器 IC 5V T1 Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS21554 制造商:Maxim Integrated Products 功能描述:
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