參數(shù)資料
型號(hào): DS21352LN+
廠商: Maxim Integrated Products
文件頁(yè)數(shù): 101/137頁(yè)
文件大小: 0K
描述: IC TXRX T1 1-CHIP 3.3V 100-LQFP
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 90
功能: 單芯片收發(fā)器
接口: HDLC,T1
電路數(shù): 1
電源電壓: 3.14 V ~ 3.47 V
電流 - 電源: 75mA
工作溫度: -40°C ~ 85°C
安裝類(lèi)型: 表面貼裝
封裝/外殼: 100-LQFP
供應(yīng)商設(shè)備封裝: 100-LQFP(14x14)
包裝: 托盤(pán)
包括: DSX-1 和 CSU 線路補(bǔ)償發(fā)生器,HDLC 控制器,帶內(nèi)回路代碼發(fā)生器和檢測(cè)器
產(chǎn)品目錄頁(yè)面: 1429 (CN2011-ZH PDF)
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)當(dāng)前第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)第118頁(yè)第119頁(yè)第120頁(yè)第121頁(yè)第122頁(yè)第123頁(yè)第124頁(yè)第125頁(yè)第126頁(yè)第127頁(yè)第128頁(yè)第129頁(yè)第130頁(yè)第131頁(yè)第132頁(yè)第133頁(yè)第134頁(yè)第135頁(yè)第136頁(yè)第137頁(yè)
DS21352/DS21552
66 of 137
TBOC.6 = 1 and TDC1.7 = 1 cannot exist without corrupting the data in the FDL. See Table 15-1 for
configuring the transmit HDLC controller.
Table 15-1 TRANSMIT HDLC CONFIGURATION
Function
TBOC.6
TDC1.7
TCR1.2
DS0(s)
0
1
1 or 0
FDL
1
0
1
Disable
0
1 or 0
Note that the BOC controller is functional when the HDLC controller is used for DS0s. Section 15.3 contains all of the HDLC
and BOC registers and information on FDL/Fs Extraction and Insertion with and without the HDLC controller.
15.1 HDLC FORr DS0s
When using the HDLC controllers for DS0s, the same registers shown in section 15.3.2 will be used
except for the TBOC and RBOC registers and bits HDLC.7, HSR.7, and HIMR.7. As a basic guideline
for interpreting and sending HDLC messages and BOC messages, the following sequences can be
applied.
15.1.1 RECEIVE AN HDLC MESSAGE
1. Enable RPS interrupts.
2. Wait for interrupt to occur.
3. Disable RPS interrupt and enable either RPE, RNE, or RHALF interrupt.
4. Read RHIR to obtain REMPTY status.
a. If REMPTY=0, then record OBYTE, CBYTE, and POK bits and then read the FIFO.
a1. If CBYTE=0 then skip to step 5.
a2. If CBYTE=1 then skip to step 7.
b. If REMPTY=1, then skip to step 6.
5. Repeat step 4.
6. Wait for interrupt, skip to step 4.
7. If POK=0, then discard whole packet, if POK=1, accept the packet.
8. Disable RPE, RNE, or RHALF interrupt, enable RPS interrupt and return to step 1.
15.1.2 TRANSMIT AN HDLC MESSAGE
1. Make sure HDLC controller is done sending any previous messages and is current sending flags by checking that the FIFO
is empty by reading the TEMPTY status bit in the THIR register.
2. Enable either the THALF or TNF interrupt.
3. Read THIR to obtain TFULL status.
a. If TFULL=0, then write a byte into the FIFO and skip to next step (special case occurs when the last byte is to be
written, in this case set TEOM=1 before writing the byte and then skip to step 6).
b. If TFULL=1, then skip to step 5.
4. Repeat step 3.
5. Wait for interrupt, skip to step 3.
6. Disable THALF or TNF interrupt and enable TMEND interrupt.
7. Wait for an interrupt, then read TUDR status bit to make sure packet was transmitted correctly.
15.2 FDL/Fs EXTRACTION AND INSERTION
The device has the ability to extract/insert data from/ into the Facility Data Link (FDL) in the ESF
framing mode and from/into Fs–bit position in the D4 framing mode. Since SLC–96 utilizes the Fs–bit
position, this capability can also be used in SLC–96 applications. The device contains a complete HDLC
and BOC controller which can be used for the FDL or for DS0s. Using the HDLC controller for the FDL
is covered in Section 15.3.3. To allow for backward compatibility with earlier devices, legacy
functionality is maintained for the FDL, which is covered in Section 15.4. Section 15.5 covers D4 and
SLC–96 operation.
相關(guān)PDF資料
PDF描述
DS2156L+ IC TXRX T1/E1/J1 1-CHIP 100-LQFP
DS2155LC2+ IC TXRX T1/E1/J1 SGL 100-LQFP
DS26504L+ IC T1/E1/J1 64KCC ELEMENT 64LQFP
MC908QT2AMFQE IC MCU 8BIT 1.5K FLASH 8-DFN
MC9S08LG16CLH IC MCU 8BIT LG16 FLASH 64-LQFP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DS21352LN+ 功能描述:網(wǎng)絡(luò)控制器與處理器 IC T1 Single Chip Transceivers RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS21354 制造商:MAXIM 制造商全稱(chēng):Maxim Integrated Products 功能描述:3.3V/5V E1 Single-Chip Transceivers
DS21354DK 功能描述:網(wǎng)絡(luò)開(kāi)發(fā)工具 DS21354 Dev Kit RoHS:否 制造商:Rabbit Semiconductor 產(chǎn)品:Development Kits 類(lèi)型:Ethernet to Wi-Fi Bridges 工具用于評(píng)估:RCM6600W 數(shù)據(jù)速率:20 Mbps, 40 Mbps 接口類(lèi)型:802.11 b/g, Ethernet 工作電源電壓:3.3 V
DS21354G 功能描述:網(wǎng)絡(luò)控制器與處理器 IC RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS21354GN 功能描述:網(wǎng)絡(luò)控制器與處理器 IC RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray