參數(shù)資料
型號： DS21352L+
廠商： Maxim Integrated Products
文件頁數(shù)： 10/137頁
文件大小： 0K
描述： IC TXRX T1 1-CHIP 3.3V 100-LQFP
產(chǎn)品培訓(xùn)模塊： Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝： 90
功能： 單芯片收發(fā)器
接口： HDLC，T1
電路數(shù)： 1
電源電壓： 3.14 V ~ 3.47 V
電流 - 電源： 75mA
工作溫度： 0°C ~ 70°C
安裝類型： 表面貼裝
封裝/外殼： 100-LQFP
供應(yīng)商設(shè)備封裝： 100-LQFP（14x14）
包裝： 托盤
包括： DSX-1 和 CSU 線路補償發(fā)生器，HDLC 控制器，帶內(nèi)回路代碼發(fā)生器和檢測器
產(chǎn)品目錄頁面： 1429 (CN2011-ZH PDF)
DS21352/DS21552
107 of 137
20. INTERLEAVED PCM BUS OPERATION
In many architectures, the outputs of individual framers are combined into higher speed serial buses to
simplify transport across the system. The DS21352/552 can be configured to allow data and signaling
buses to be multiplexed into higher speed data and signaling buses eliminating external hardware saving
board space and cost.
The interleaved PCM bus option (IBO) supports two bus speeds. The 4.096 MHz bus speed allows two
SCTs to share a common bus. The 8.192 MHz bus speed allows four SCTs to share a common bus. See
Figure 20-1 for an example of 4 devices sharing a common 8.192MHz PCM bus. Each SCT that shares a
common bus must be configured through software and requires the use of one or two device pins. The
elastic stores of each SCT must be enabled and configured for 2.048 MHz operation. See Figure 21-6
and Figure 21-7.
For all bus configurations, one SCT will be configured as the master device and the remaining SCTs will
be configured as slave devices. In the 4.096 MHz bus configuration there is one master and one slave. In
the 8.192 MHz bus configuration there is one master and three slaves. Refer to the IBO register
description for more detail.
IBO: INTERLEAVE BUS OPERATION REGISTER (Address = 94 Hex)
(MSB)
(LSB)
-
IBOEN
INTSEL
MSEL0
MSEL1
SYMBOL
POSITION
NAME AND DESCRIPTION
-IBO.7
Not Assigned. Should be set to 0.
-IBO.6
Not Assigned. Should be set to 0.
-IBO.5
Not Assigned. Should be set to 0.
-IBO.4
Not Assigned. Should be set to 0.
IBOEN
IBO.3
Interleave Bus Operation Enable
0 = Interleave Bus Operation disabled.
1 = Interleave Bus Operation enabled.
INTSEL
IBO.2
Interleave Type Select
0 = Byte interleave.
1 = Frame interleave.
MSEL0
IBO.1
Master Device Bus Select Bit 0. See Table 20-1.
MSEL1
IBO.0
Master Device Bus Select Bit 1. See Table 20-1.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DS21352L+ 功能描述:網(wǎng)絡(luò)控制器與處理器 IC T1 Single Chip Transceivers RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS21352LB 功能描述:網(wǎng)絡(luò)控制器與處理器 IC T1 Single Chip Transceivers RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS21352LB+ 功能描述:網(wǎng)絡(luò)控制器與處理器 IC T1 Single Chip Transceivers RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS21352LBN 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述:
DS21352L-C02 功能描述:網(wǎng)絡(luò)控制器與處理器 IC T1 Single Chip Transceivers RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
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