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參數(shù)資料
| 型號： | DS1647P |
| 廠商： | DALLAS SEMICONDUCTOR |
| 元件分類： | XO, clock |
| 英文描述： | Nonvolatile Timekeeping RAM(非易失性計時RAM) |
| 中文描述： | 0 TIMER(S), REAL TIME CLOCK, DMA34 |
| 封裝： | POWERCAP MODULE-34 |
| 文件頁數(shù)： | 9/12頁 |
| 文件大?。?/td> | 131K |
| 代理商： | DS1647P |
DS1647/DS1647P
031798 9/12
NOTES:
1. All voltages are referenced to ground.
2. Typical values are at 25
°
C and nominal supplies.
3. Outputs are open.
4. Data retention time is at 25
°
C and is calculated from
the date code on the device package. The date code
XXYY is the year followed by the week of the year
in which the device was manufactured. For exam-
ple, 9225, would mean the 25th week of 1992.
5. t
AH1
, t
DH1
are measured from WE going high.
6. t
AH2
, t
DH2
are measured from CE going high.
OUTPUT LOAD
+5 VOLTS
100 pF
D.U.T.
1.8K
1K
7. Real–Time Clock Modules (DIP) can be successfully processed through conventional wave–soldering tech-
niques as long as temperature exposure to the lithium energy source contained within does not exceed +85
°
C.
Post solder cleaning with water washing techniques is acceptable, provided that ultrasonic vibration is not used.
In addition, for the PowerCap version:
a.
Dallas Semiconductor recommends that PowerCap Module bases experience one pass through solder
reflow oriented with the label side up (“l(fā)ive – bug”).
b.
Hand Soldering and touch – up: Do not touch or apply the soldering iron to leads for more than 3 (three)
seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove the part,
apply flux, heat the lead frame pad until the solder reflows and use a solder wick to remove solder.
DS1647 32–PIN PACKAGE
A
1
DIM
MIN
MAX
A
IN.
MM
B
IN.
MM
C
IN.
MM
D
IN.
MM
E
IN.
MM
F
IN.
MM
G IN.
MM
H
IN.
MM
J
IN.
MM
K
IN.
MM
1.670
38.42
1.690
38.93
0.715
18.16
0.740
18.80
0.335
8.51
0.365
9.27
0.075
1.91
0.105
0.67
0.015
0.38
0.030
0.76
0.140
3.56
0.180
4.57
0.090
2.29
0.110
2.79
0.590
14.99
0.630
16.00
0.010
0.25
0.018
0.45
0.015
0.38
0.025
0.64
C
F
G
K
D
H
B
E
J
32–PIN
PKG
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