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參數(shù)資料
| 型號(hào)： | DRV102T |
| 英文描述： | PWM SOLENOID/VALVE DRIVER |
| 中文描述： | 脈寬調(diào)制電磁/閥驅(qū)動(dòng) |
| 文件頁(yè)數(shù)： | 12/19頁(yè) |
| 文件大?。?/td> | 253K |
| 代理商： | DRV102T |
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12
DRV102
FIGURE 11. TO-220 Thermal Resistance versus Aluminum Plate Area.
For best thermal performance, the tab of the DDPAK sur-
face-mount version should be soldered directly to a circuit
board copper area. Increasing the copper area improves heat
dissipation. Figure 12 shows typical thermal resistance from
junction-to-ambient as a function of the copper area.
POWER DISSIPATION
Power dissipation depends on power supply, signal, and load
conditions. Power dissipation is equal to the product of
FIGURE 10. TO-220 and DDPAK Solder Footprints.
PACKAGE MOUNTING
Figure 10 provides recommended PCB layouts for both the
TO-220 and DDPAK power packages. The tab of both
packages is electrically connected to ground (pin 4). It may
be desirable to isolate the tab of TO-220 package from its
mounting surface with a mica (or other film) insulator (see
Figure 11). For lowest overall thermal resistance, it is best to
isolate the entire heat sink/DRV102 structure from the
mounting surface rather than to use an insulator between the
semiconductor and heat sink.
7-Lead DDPAK
(1)
(Package Drawing #328)
7-Lead TO-220
(Package Drawing #327)
NOTE: (1) For improved thermal performance increase footprint area.
See Figure 12, “Thermal Resistance versus Circuit Board Copper Area”.
0
0
0.05
0
0.51
0.105
0.05
0.035
0.04
0
0
Mean dimensions in inches. Refer to end of data sheet
or Appendix C of Burr-Brown Data Book for tolerances
and detailed package drawings. For further information
on solder pads for surface-mount devices consult
Application Bulletin AB-132.
0
1
2
3
4
5
6
7
8
18
16
14
12
10
8
T
J
°
C
Aluminum Plate Area (inches
2
)
THERMAL RESISTANCE
vs ALUMINUM PLATE AREA
Aluminum Plate Area
Flat, Rectangular
Aluminum Plate
DRV102
TO-220 Package
θ
0.030
0.062
0.050
Vertically Mounted
in Free Air
Optional mica or film insulator
for electrical isolation. Adds
approximately 1
°
C/W.
Aluminum Plate
Thickness (inches)
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| DRV102T | 制造商:BURR-BROWN 功能描述:SOLENOID/VALVE DRIVER PWM TO-220-7 |
| DRV102TG3 | 功能描述:馬達(dá)/運(yùn)動(dòng)/點(diǎn)火控制器和驅(qū)動(dòng)器 PWM Solenoid/Valve Driver RoHS:否 制造商:STMicroelectronics 產(chǎn)品:Stepper Motor Controllers / Drivers 類(lèi)型:2 Phase Stepper Motor Driver 工作電源電壓:8 V to 45 V 電源電流:0.5 mA 工作溫度:- 25 C to + 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HTSSOP-28 封裝:Tube |
| DRV103 | 制造商:TI 制造商全稱(chēng):Texas Instruments 功能描述:PWM LOW-SIDE DRIVER (1.5A and 3A) for Solenoids, Coils, Valves, Heaters, and Lamps |
| DRV103H | 功能描述:馬達(dá)/運(yùn)動(dòng)/點(diǎn)火控制器和驅(qū)動(dòng)器 Low Side Driver 1.5A/3A RoHS:否 制造商:STMicroelectronics 產(chǎn)品:Stepper Motor Controllers / Drivers 類(lèi)型:2 Phase Stepper Motor Driver 工作電源電壓:8 V to 45 V 電源電流:0.5 mA 工作溫度:- 25 C to + 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HTSSOP-28 封裝:Tube |
| DRV103H | 制造商:Texas Instruments 功能描述:PWM LOW SIDE DRIVER 1.5A/3A HSOP8 |
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