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    參數(shù)資料
    型號: DAC8801IDGKRG4
    廠商: TEXAS INSTRUMENTS INC
    元件分類: DAC
    英文描述: SERIAL INPUT LOADING, 0.5 us SETTLING TIME, 14-BIT DAC, PDSO8
    封裝: 3 X 5 MM, GREEN, PLASTIC, MSOP-8
    文件頁數(shù): 5/20頁
    文件大?。?/td> 629K
    代理商: DAC8801IDGKRG4
    PACKAGING INFORMATION
    Orderable Device
    Status
    (1)
    Package
    Type
    Package
    Drawing
    Pins Package
    Qty
    Eco Plan
    (2)
    Lead/Ball Finish
    MSL Peak Temp
    (3)
    DAC8801IDGKR
    ACTIVE
    MSOP
    DGK
    8
    2500 Green (RoHS &
    no Sb/Br)
    CU NIPDAU
    Level-2-260C-1 YEAR
    DAC8801IDGKRG4
    ACTIVE
    MSOP
    DGK
    8
    2500 Green (RoHS &
    no Sb/Br)
    CU NIPDAU
    Level-2-260C-1 YEAR
    DAC8801IDGKT
    ACTIVE
    MSOP
    DGK
    8
    250
    Green (RoHS &
    no Sb/Br)
    CU NIPDAU
    Level-2-260C-1 YEAR
    DAC8801IDGKTG4
    ACTIVE
    MSOP
    DGK
    8
    250
    Green (RoHS &
    no Sb/Br)
    CU NIPDAU
    Level-2-260C-1 YEAR
    DAC8801IDRBR
    ACTIVE
    SON
    DRB
    8
    3000 Green (RoHS &
    no Sb/Br)
    CU NIPDAU
    Level-2-260C-1 YEAR
    DAC8801IDRBRG4
    ACTIVE
    SON
    DRB
    8
    3000 Green (RoHS &
    no Sb/Br)
    CU NIPDAU
    Level-2-260C-1 YEAR
    DAC8801IDRBT
    ACTIVE
    SON
    DRB
    8
    250
    Green (RoHS &
    no Sb/Br)
    CU NIPDAU
    Level-2-260C-1 YEAR
    DAC8801IDRBTG4
    ACTIVE
    SON
    DRB
    8
    250
    Green (RoHS &
    no Sb/Br)
    CU NIPDAU
    Level-2-260C-1 YEAR
    (1) The marketing status values are defined as follows:
    ACTIVE: Product device recommended for new designs.
    LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
    NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
    a new design.
    PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
    OBSOLETE: TI has discontinued the production of the device.
    (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
    http://www.ti.com/productcontent for the latest availability information and additional product content details.
    TBD: The Pb-Free/Green conversion plan has not been defined.
    Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
    for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
    at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
    Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
    package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
    compatible) as defined above.
    Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
    retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
    (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
    temperature.
    Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
    provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
    accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
    reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
    incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
    information may not be available for release.
    In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
    to Customer on an annual basis.
    PACKAGE OPTION ADDENDUM
    www.ti.com
    10-Jul-2008
    Addendum-Page 1
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    參數(shù)描述
    DAC8801IDGKT 功能描述:數(shù)模轉(zhuǎn)換器- DAC 14-Bit Serial Input Multiplying RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube
    DAC8801IDGKT 制造商:Texas Instruments 功能描述:IC DAC 14BIT MULTIPLYING 8-MSOP 制造商:Texas Instruments 功能描述:IC, DAC 14BIT MULTIPLYING 8-MSOP 制造商:Texas Instruments 功能描述:IC, DAC 14BIT MULTIPLYING 8-MSOP; Resolution (Bits):14bit; Sampling Rate:2MSPS; Input Channel Type:Serial; Supply Voltage Range:2.7V to 5.5V; Digital IC Case Style:SOP; No. of Pins:8; Data Interface:3 Wire, Serial; Supply ;RoHS Compliant: Yes
    DAC8801IDGKTG4 功能描述:數(shù)模轉(zhuǎn)換器- DAC 14-Bit Serial Input Mult DAC RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube
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