參數(shù)資料
型號： CYD09S36V
廠商： Cypress Semiconductor Corp.
英文描述： FLEx36TM 3.3V 32K/64K/128K/256K/512 x 36 Synchronous Dual-Port RAM(FLEx36TM 3.3V 32K/64K/128K/256K/512 x 36同步雙端口RAM)
中文描述： FLEx36TM 3.3 32K/64K/128K/256K/512 × 36同步雙口RAM（FLEx36TM 3.3 32K/64K/128K/256K/512 × 36同步雙端口RAM）的
文件頁數(shù)： 25/28頁
文件大?。?/td> 608K
代理商： CYD09S36V
CYD01S36V
CYD02S36V/CYD04S36V
CYD09S36V/CYD18S36V
Document #: 38-06076 Rev. *E
Page 25 of 28
Ordering Information
512K
×
36 (18-Mbit) 3.3V Synchronous CYD18S36V Dual-Port SRAM
Speed(
MHz)
Ordering Code
133
CYD18S36V-133BBC
CYD18S36V-133BBI
100
CYD18S36V-100BBC
CYD18S36V-100BBI
256K
×
36 (9-Mbit) 3.3V Synchronous CYD09S36V Dual-Port SRAM
Speed(
MHz)
Ordering Code
167
CYD09S36V-167BBC
133
CYD09S36V-133BBC
CYD09S36V-133BBI
128K
×
36 (4-Mbit) 3.3V Synchronous CYD04S36V Dual-Port SRAM
Speed(
MHz)
Ordering Code
167
CYD04S36V-167BBC
133
CYD04S36V-133BBC
CYD04S36V-133BBI
64K
×
36 (2-Mbit) 3.3V Synchronous CYD02S36V Dual-Port SRAM
Speed(
MHz)
Ordering Code
167
CYD02S36V-167BBC
133
CYD02S36V-133BBC
CYD02S36V-133BBI
32K
×
36 (1-Mbit) 3.3V Synchronous CYD01S36V Dual-Port SRAM
Speed(
MHz)
Ordering Code
167
CYD01S36V-167BBC
133
CYD01S36V-133BBC
CYD01S36V-133BBI
Package
Name
BB256B
BB256B
BB256B
BB256B
Package Type
Operating
Range
256-ball Grid Array 23 mm × 23 mm with 1.0-mm pitch (BGA)
Commercial
256-ball Grid Array 23 mm × 23 mm with 1.0-mm pitch (BGA)
Industrial
256-ball Grid Array 23 mm × 23 mm with 1.0-mm pitch (BGA)
Commercial
256-ball Grid Array 23 mm × 23 mm with 1.0-mm pitch (BGA)
Industrial
Package
Name
BB256
BB256
BB256
Package Type
Operating
Range
256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA)
Commercial
256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA)
Commercial
256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA)
Industrial
Package
Name
BB256
BB256
BB256
Package Type
Operating
Range
256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA)
Commercial
256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA)
Commercial
256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA)
Industrial
Package
Name
BB256
BB256
BB256
Package Type
Operating
Range
256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA)
Commercial
256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA)
Commercial
256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA)
Industrial
Package
Name
BB256
BB256
BB256
Package Type
Operating
Range
256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA)
Commercial
256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA)
Commercial
256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA)
Industrial
相關(guān)PDF資料
PDF描述
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CYD04S72V18 FullFlex Synchronous SDR Dual-Port SRAM(FullFlex同步SDR雙端口SRAM)
CYD36S72V18 FullFlex Synchronous SDR Dual-Port SRAM(FullFlex同步SDR雙端口SRAM)
CYD09S72V18 FullFlex Synchronous SDR Dual-Port SRAM(FullFlex同步SDR雙端口SRAM)
CYD36S18V18 FullFlex Synchronous SDR Dual-Port SRAM(FullFlex同步SDR雙端口SRAM)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CYD09S36V-133BBC 制造商:Rochester Electronics LLC 功能描述:3.3V, 256K X 36 SYNCH DUAL-PORT SRAM (FLEX36 9M) - Bulk
CYD09S36V-133BBI 制造商:CYPRESS 制造商全稱:Cypress Semiconductor 功能描述:FLEx36 3.3V 32K/64K/128K/256K/512 x 36 Synchronous Dual-Port RAM
CYD09S36V-167BBC 制造商:Rochester Electronics LLC 功能描述:3.3V, 256K X 36 SYNCH DUAL-PORT SRAM (FLEX36 9M) - Bulk
CYD09S36V18 制造商:CYPRESS 制造商全稱:Cypress Semiconductor 功能描述:18-Mb/9-Mb/4-Mb x36/x18 FullFlex⑩ Dual-Ports
CYD09S36V18-167BBXC 功能描述:靜態(tài)隨機(jī)存取存儲器 9MB (256Kx36) 1.8v 167MHz Sync 靜態(tài)隨機(jī)存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
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