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| 型號： | CY8C21223 |
| 廠商： | Cypress Semiconductor Corp. |
| 英文描述： | PSoC Mixed-Signal Array(PSoC混合信號陣列) |
| 中文描述： | PSoC混合信號陣列（的PSoC混合信號陣列） |
| 文件頁數(shù)： | 7/33頁 |
| 文件大小： | 325K |
| 代理商： | CY8C21223 |
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February 25, 2005
Document No. 38-12022 Rev. *G
7
CY8C21x23 Final Data Sheet
PSoC Overview
Document Conventions
Acronyms Used
The following table lists the acronyms that are used in this doc-
ument.
Units of Measure
A units of measure table is located in the Electrical Specifica-
tions section.
Table 3-1 on page 14
lists all the abbreviations
used to measure the PSoC devices.
Numeric Naming
Hexidecimal numbers are represented with all letters in upper-
case with an appended lowercase ‘h’ (for example, ‘14h’ or
‘3Ah’). Hexidecimal numbers may also be represented by a ‘0x’
prefix, the C coding convention. Binary numbers have an
appended lowercase ‘b’ (e.g., 01010100b’ or ‘01000011b’).
Numbers not indicated by an ‘h’, ‘b’, or 0x are decimal.
Table of Contents
For an in depth discussion and more information on your PSoC
device, obtain the
PSoC Mixed-Signal Array Technical Refer-
ence Manual
on
http://www.cypress.com
. This data sheet
encompasses and is organized into the following chapters and
sections.
Pin Information ............................................................. 81.1
Pinouts ................................................................... 8
1.1.1
8-Pin Part Pinout ...................................... 8
1.1.2
16-Pin Part Pinout ..................................... 8
1.1.3
20-Pin Part Pinout .................................... 9
1.1.4
24-Pin Part Pinout ................................. 10
2.
Register Reference ..................................................... 11
2.1
Register Conventions ........................................... 11
2.2
Register Mapping Tables ..................................... 11
3.
Electrical Specifications ............................................ 14
3.1
Absolute Maximum Ratings ................................ 15
3.2
Operating Temperature ....................................... 15
3.3
DC Electrical Characteristics ................................ 15
3.3.1
DC Chip-Level Specifications ................... 15
3.3.2
DC General Purpose IO Specifications .... 16
3.3.3
DC Amplifier Specifications ..................... 17
3.3.4
DC Switch Mode Pump Specifications ..... 18
3.3.5
DC POR and LVD Specifications ............. 19
3.3.6
DC Programming Specifications ............... 20
3.4
AC Electrical Characteristics ................................ 21
3.4.1
AC Chip-Level Specifications ................... 21
3.4.2
AC General Purpose IO Specifications .... 23
3.4.3
AC Amplifier Specifications ...................... 24
3.4.4
AC Digital Block Specifications ................. 24
3.4.5
AC External Clock Specifications ............. 26
3.4.6
AC Programming Specifications ............... 27
3.4.7
AC I2C Specifications ............................... 27
4.
Packaging Information ............................................... 29
4.1
Packaging Dimensions ......................................... 29
4.2
Thermal Impedances .......................................... 31
4.3
Solder Reflow Peak Temperature ........................ 31
5.
Ordering Information .................................................. 32
5.1
Ordering Code Definitions ................................... 32
6.
Sales and Service Information .................................. 33
6.1
Revision History .................................................. 33
6.2
Copyrights and Flash Code Protection ................ 33
Acronym
Description
AC
alternating current
ADC
analog-to-digital converter
API
application programming interface
CPU
central processing unit
CT
continuous time
DAC
digital-to-analog converter
DC
direct current
EEPROM
electrically erasable programmable read-only memory
FSR
full scale range
GPIO
general purpose IO
IO
input/output
IPOR
imprecise power on reset
LSb
least-significant bit
LVD
low voltage detect
MSb
most-significant bit
PC
program counter
POR
power on reset
PPOR
precision power on reset
PSoC
Programmable System-on-Chip
PWM
pulse width modulator
ROM
read only memory
SC
switched capacitor
SMP
switch mode pump
SRAM
static random access memory
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CY8C21223-24LGXI | 功能描述:可編程片上系統(tǒng) - PSoC 4Kb 256K RAM RoHS:否 制造商:Cypress Semiconductor 核心:8051 處理器系列:CY8C36 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:67 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:4 KB 片上 ADC:Yes 工作電源電壓:0.5 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:QFN-68 安裝風(fēng)格:SMD/SMT |
| CY8C21223-24LGXIT | 功能描述:可編程片上系統(tǒng) - PSoC PSoC MCU 4K, 256 RAM RoHS:否 制造商:Cypress Semiconductor 核心:8051 處理器系列:CY8C36 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:67 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:4 KB 片上 ADC:Yes 工作電源電壓:0.5 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:QFN-68 安裝風(fēng)格:SMD/SMT |
| CY8C21223-24SXI | 功能描述:可編程片上系統(tǒng) - PSoC IC MCU 4K FLASH 256B SRAM RoHS:否 制造商:Cypress Semiconductor 核心:8051 處理器系列:CY8C36 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:67 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:4 KB 片上 ADC:Yes 工作電源電壓:0.5 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:QFN-68 安裝風(fēng)格:SMD/SMT |
| CY8C21223-24SXIT | 功能描述:可編程片上系統(tǒng) - PSoC 4K Flsh 256B RAM IND RoHS:否 制造商:Cypress Semiconductor 核心:8051 處理器系列:CY8C36 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:67 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:4 KB 片上 ADC:Yes 工作電源電壓:0.5 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:QFN-68 安裝風(fēng)格:SMD/SMT |
| CY8C212234-24SXI | 功能描述:PROGRAMMABLE SYSTEM ON A CHIP RoHS:是 類別:未定義的類別 >> 其它 系列:* 標(biāo)準(zhǔn)包裝:1 系列:* 其它名稱:MS305720A |
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