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參數(shù)資料
| 型號： | CY7C68015A-56LFXC |
| 廠商： | CYPRESS SEMICONDUCTOR CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | EZ-USB FX2LP USB Microcontroller |
| 中文描述： | 8-BIT, EEPROM, 48 MHz, MICROCONTROLLER, QCC56 |
| 封裝： | 8 X 8 MM, LEAD FREE, MO-220, QFN-56 |
| 文件頁數(shù)： | 53/55頁 |
| 文件大?。?/td> | 1958K |
| 代理商： | CY7C68015A-56LFXC |
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CY7C68013A/CY7C68014A
CY7C68015A/CY7C68016A
Document #: 38-08032 Rev. *G
Page 53 of 55
12.0
PCB Layout Recommendations
[24]
The following recommendations should be followed to ensure
reliable high-performance operation.
At least a four-layer impedance controlled boards are re-
quired to maintain signal quality.
Specify impedance targets (ask your board vendor what
they can achieve).
To control impedance, maintain trace widths and trace spac-
ing.
Minimize stubs to minimize reflected signals.
Connections between the USB connector shell and signal
ground must be done near the USB connector.
Bypass/flyback caps on VBus, near connector, are recom-
mended.
DPLUS and DMINUS trace lengths should be kept to within
2 mm of each other in length, with preferred length of 20-
30 mm.
Maintain a solid ground plane under the DPLUS and DMI-
NUS traces. Do not allow the plane to be split under these
traces.
It is preferred is to have no vias placed on the DPLUS or
DMINUS trace routing.
Isolate the DPLUS and DMINUS traces from all other signal
traces by no less than 10 mm.
13.0
Package Design Notes
Quad Flat Package No Leads (QFN)
Electrical contact of the part to the Printed Circuit Board (PCB)
is made by soldering the leads on the bottom surface of the
package to the PCB. Hence, special attention is required to the
heat transfer area below the package to provide a good
thermal bond to the circuit board. A Copper (Cu) fill is to be
designed into the PCB as a thermal pad under the package.
Heat is transferred from the FX2LP through the device’s metal
paddle on the bottom side of the package. Heat from here, is
conducted to the PCB at the thermal pad. It is then conducted
from the thermal pad to the PCB inner ground plane by a 5 x 5
array of via. A via is a plated through hole in the PCB with a
finished diameter of 13 mil. The QFN’s metal die paddle must
be soldered to the PCB’s thermal pad. Solder mask is placed
on the board top side over each via to resist solder flow into
the via. The mask on the top side also minimizes outgassing
during the solder reflow process.
Note:
24. Source for recommendations:
EZ-USB FX2PCB Design Recommendations
, http://www.cypress.com/cfuploads/support/app_notes/FX2_PCB.pdf and
High
Speed USB Platform Design Guidelines
, http://www.usb.org/developers/docs/hs_usb_pdg_r1_0.pdf.
Package Diagrams
(continued)
51-85101-*B
Figure 11-4. 128-Lead Thin Plastic Quad Flatpack (14 x 20 x 1.4 mm) A128
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CY7C68015A-56LTXC | 功能描述:USB 接口集成電路 USB HS Controller RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| CY7C68015A-56LTXCKA | 制造商:Rochester Electronics LLC 功能描述: 制造商:Cypress Semiconductor 功能描述: |
| CY7C68015A-56PVXC | 功能描述:8位微控制器 -MCU EZ USB FX2LP LO PWR Extra GPIO COM RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| CY7C68016A-56LFXC | 功能描述:8位微控制器 -MCU EZ USB FX2LP Battery Apps Extra GPIO COM RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| CY7C68016A-56LFXCT | 功能描述:8位微控制器 -MCU EZ-USB FX2LP,Ex GPIO RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
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