參數(shù)資料
型號: CY7C65640-LFXC
廠商: CYPRESS SEMICONDUCTOR CORP
元件分類: 總線控制器
英文描述: TetraHub High-speed USB Hub Controller
中文描述: UNIVERSAL SERIAL BUS CONTROLLER, QCC56
封裝: 8 X 8 MM, LEAD FREE, QFN-56
文件頁數(shù): 25/27頁
文件大?。?/td> 675K
代理商: CY7C65640-LFXC
CY7C65640
Document #: 38-08019 Rev. *E
Page 25 of 27
15.0
Ordering Information
16.0
Package Diagrams
The TetraHub is available in a space-saving 56-pin QFN (8 X 8 mm)
Note:
The bottom metal pad size varies by product due to die size variable. If metal pad design or dimension are critical with your board
designs, please contact Cypress Sales office to get the specific outline option.
16.1
The QFN (Quad Flatpack No Leads), being a lead free package, the electrical contact of the part to the Printed Circuit Board
(PCB) is made by soldering the lands on the bottom surface of the package to the PCB. Hence special attention is required to
the heat transfer area below the package to provide a good thermal bond to the circuit board. A Copper (Cu) fill should be designed
into the PCB as a thermal pad under the package. Heat is transferred from the TeraHub through the device’s metal paddle on the
bottom side of the package. Heat from here is conducted to the PCB at the thermal pad. It is then conducted from the thermal
pad to the PCB inner ground plane by a 5 x 5 array of Via. A Via is a plated through-hole in the PCB with a finished diameter of
13 mil. The QFN’s metal die paddle must be soldered to the PCB’s thermal pad. Solder mask is placed on the board top side over
each Via to resist solder flow into the Via. The mask on the top side also minimizes outgassing during the solder reflow process.
Please follow the layout guidelines provided in the PCB layout files accompanied with the CY4602 TetraHub Reference Design
Kit. The information in this section was derived from the original application note by the package vendor. For further information
on this package design please refer to the application note “Surface Mount Assembly of AMKOR’s MicroLeadFrame (MLF)
Technology”. This application note can be downloaded from AMKOR’s website from the following URL
http://www.amkor.com/products/notes_papers/MLF_AppNote_0301.pdf.
This application note provides detailed information on board mounting guidelines, soldering flow, rework process, etc.
Quad Flat Package No Leads (QFN) Package Design Notes
Ordering Code
Package Type
CY7C65640-LFC
CY7C65640-LFXC
CY4602
56-pin QFN
56-pin QFN Lead Free Package
TetraHub USB 2.0 4 port Hub Reference Design Kit
0.80[0.031]
7.70[0.303]
7.80[0.307]
7.90[0.311]
8.10[0.319]
A
C
1.00[0.039] MAX.
N
SEATING
N
2
0.18[0.007]
0.28[0.011]
0.50[0.020]
1
1
2
0.08[0.003]
0.50[0.020]
0.05[0.002] MAX.
(4X)
C
0.24[0.009]
0.60[0.024]
0.20[0.008] REF.
0.80[0.031] MAX.
PIN1 ID
0.20[0.008] R.
0°-12°
6.45[0.254]
6.55[0.258]
0.45[0.018]
8
7
7
7
DIA.
0.30[0.012]
6
6
TOP VIEW
BOTTOM VIEW
SIDE VIEW
E-PAD
(PAD SIZE VARY
BY DEVICE TYPE)
51-85144-*D
56-Lead QFN 8 x 8 MM LF56A
Dimensions are in milimeters
MIN
MAX
相關(guān)PDF資料
PDF描述
CY7C65640 TetraHub High-speed USB Hub Controller
CY7C65640-LFC TetraHub High-speed USB Hub Controller
CY4602 TetraHub High-speed USB Hub Controller
CY7C65640A TetraHub High-Speed USB Hub Controller(TetraHub高速USB Hub控制器)
CY7C67200 EZ-OTG Programmable USB On-The-Go Host/Peripheral Controller(EZ-OTG可編程USB On-The-Go主機/外圍設(shè)備控制器)
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