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參數(shù)資料
| 型號： | CY7C1522AV18-250BZI |
| 廠商： | CYPRESS SEMICONDUCTOR CORP |
| 元件分類： | DRAM |
| 英文描述： | 72-Mbit DDR-II SIO SRAM 2-Word Burst Architecture |
| 中文描述： | 8M X 8 DDR SRAM, 0.45 ns, PBGA165 |
| 封裝： | 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 |
| 文件頁數(shù)： | 11/28頁 |
| 文件大小： | 1133K |
| 代理商： | CY7C1522AV18-250BZI |
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PRELIMINARY
CY7C1522AV18
CY7C1529AV18
CY7C1523AV18
CY7C1524AV18
Document #: 001-06981 Rev. *B
Page 11 of 28
Write Cycle Descriptions
(CY7C1524AV18)
[3, 9]
BWS
0
L
BWS
1
L
BWS
2
L
BWS
3
L
K
K
–
Comments
L-H
During the Data portion of a Write sequence, all four bytes (D
[35:0]
) are written into
the device.
L-H During the Data portion of a Write sequence, all four bytes (D
[35:0]
) are written into
the device.
-
During the Data portion of a Write sequence, only the lower byte (D
[8:0]
) is written
into the device. D
[35:9]
will remain unaltered.
L-H During the Data portion of a Write sequence, only the lower byte (D
[8:0]
) is written
into the device. D
[35:9]
will remain unaltered.
–
During the Data portion of a Write sequence, only the byte (D
[17:9]
) is written into
the device. D
[8:0]
and D
[35:18]
will remain unaltered.
L-H During the Data portion of a Write sequence, only the byte (D
[17:9]
) is written into
the device. D
[8:0]
and D
[35:18]
will remain unaltered.
–
During the Data portion of a Write sequence, only the byte (D
[26:18]
) is written into
the device. D
[17:0]
and D
[35:27]
will remain unaltered.
L-H During the Data portion of a Write sequence, only the byte (D
[26:18]
) is written into
the device. D
[17:0]
and D
[35:27]
will remain unaltered.
During the Data portion of a Write sequence, only the byte (D
[35:27]
) is written into
the device. D
[26:0]
will remain unaltered.
L-H During the Data portion of a Write sequence, only the byte (D
[35:27]
) is written into
the device. D
[26:0]
will remain unaltered.
–
No data is written into the device during this portion of a Write operation.
L-H No data is written into the device during this portion of a Write operation.
Write Cycle Descriptions
(CY7C1529AV18)
[3
,
9]
L
L
L
L
–
L
H
H
H
L-H
L
H
H
H
–
H
L
H
H
L-H
H
L
H
H
–
H
H
L
H
L-H
H
H
L
H
–
H
H
H
L
L-H
H
H
H
L
–
H
H
H
H
H
H
H
H
L-H
–
BWS
0
L
L
H
H
K
K
–
Comments
L-H
–
L-H
–
During the Data portion of a Write sequence, the single byte (D
[8:0]
) is written into the device.
During the Data portion of a Write sequence, the single byte (D
[8:0]
) is written into the device.
No data is written into the device during this portion of a Write operation.
No data is written into the device during this portion of a Write operation.
L-H
–
L-H
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相關PDF資料 |
PDF描述 |
|---|---|
| CY7C1522AV18-250BZXC | 72-Mbit DDR-II SIO SRAM 2-Word Burst Architecture |
| CY7C1522AV18-250BZXI | 72-Mbit DDR-II SIO SRAM 2-Word Burst Architecture |
| CY7C1523AV18-300BZC | 72-Mbit DDR-II SIO SRAM 2-Word Burst Architecture |
| CY7C1523AV18-300BZI | 72-Mbit DDR-II SIO SRAM 2-Word Burst Architecture |
| CY7C1523AV18-300BZXC | 72-Mbit DDR-II SIO SRAM 2-Word Burst Architecture |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| CY7C1523AV18-200BZC | 功能描述:靜態(tài)隨機存取存儲器 4M x 18 1.8V DDR II SIO 靜態(tài)隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |
| CY7C1523AV18-250BZC | 功能描述:靜態(tài)隨機存取存儲器 4M x 18 1.8V DDR II SIO 靜態(tài)隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |
| CY7C1523JV18-300BZXC | 功能描述:靜態(tài)隨機存取存儲器 4Mbx18 72Mb 1.7-1.9V 300 MHz 2 WORD BURST RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |
| CY7C1523KV18-250BZ | 制造商:Cypress Semiconductor 功能描述: |
| CY7C1523KV18-250BZXC | 功能描述:靜態(tài)隨機存取存儲器 72MB (4Mx18) 1.8v 250MHz DDR II 靜態(tài)隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |
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