參數(shù)資料
型號(hào): CY7C1520AV18-167BZC
廠商: CYPRESS SEMICONDUCTOR CORP
元件分類: DRAM
英文描述: 72-Mbit DDR-II SRAM 2-Word Burst Architecture
中文描述: 2M X 36 DDR SRAM, 0.5 ns, PBGA165
封裝: 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
文件頁數(shù): 26/28頁
文件大?。?/td> 1133K
代理商: CY7C1520AV18-167BZC
PRELIMINARY
CY7C1516AV18
CY7C1527AV18
CY7C1518AV18
CY7C1520AV18
Document #: 001-06982 Rev. *B
Page 26 of 28
250
CY7C1516AV18-250BZI
CY7C1518AV18-250BZI
CY7C1520AV18-250BZI
CY7C1527AV18-250BZI
CY7C1516AV18-250BZXI
CY7C1518AV18-250BZXI
CY7C1520AV18-250BZXI
CY7C1527AV18-250BZXI
CY7C1516AV18-200BZC
CY7C1518AV18-200BZC
CY7C1520AV18-200BZC
CY7C1527AV18-200BZC
CY7C1516AV18-200BZXC 51-85195 165-ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Lead-Free Commercial
CY7C1518AV18-200BZXC
CY7C1520AV18-200BZXC
CY7C1527AV18-200BZXC
CY7C1516AV18-200BZI
51-85195 165-ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm)
CY7C1518AV18-200BZI
CY7C1520AV18-200BZI
CY7C1527AV18-200BZI
CY7C1516AV18-200BZXI
51-85195 165-ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Lead-Free
CY7C1518AV18-200BZXI
CY7C1520AV18-200BZXI
CY7C1527AV18-200BZXI
CY7C1516AV18-167BZC
51-85195 165-ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm)
CY7C1518AV18-167BZC
CY7C1520AV18-167BZC
CY7C1527AV18-167BZC
CY7C1516AV18-167BZXC 51-85195 165-ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Lead-Free Commercial
CY7C1518AV18-167BZXC
CY7C1520AV18-167BZXC
CY7C1527AV18-167BZXC
CY7C1516AV18-167BZI
51-85195 165-ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm)
CY7C1518AV18-167BZI
CY7C1520AV18-167BZI
CY7C1527AV18-167BZI
CY7C1516AV18-167BZXI
51-85195 165-ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Lead-Free
CY7C1518AV18-167BZXI
CY7C1520AV18-167BZXI
CY7C1527AV18-167BZXI
51-85195 165-ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm)
Industrial
250
51-85195 165-ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Lead-Free
Industrial
200
51-85195 165-ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm)
Commercial
200
200
Industrial
200
Industrial
167
Commercial
167
167
Industrial
167
Industrial
Ordering Information
(continued)
“Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or
visit
www.cypress.com
for actual products offered”.
Speed
(MHz)
Ordering Code
Diagram
Package
Package Type
Operating
Range
[+] Feedback
相關(guān)PDF資料
PDF描述
CY7C1520AV18-167BZI 72-Mbit DDR-II SRAM 2-Word Burst Architecture
CY7C1520AV18-167BZXC 72-Mbit DDR-II SRAM 2-Word Burst Architecture
CY7C1520AV18-167BZXI 72-Mbit DDR-II SRAM 2-Word Burst Architecture
CY7C1520AV18-200BZC 72-Mbit DDR-II SRAM 2-Word Burst Architecture
CY7C1520AV18-200BZI 72-Mbit DDR-II SRAM 2-Word Burst Architecture
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CY7C1520AV18-200BZC 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 2M x 36 1.8V DDR II 靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1520AV18-200BZCT 功能描述:IC SRAM 72MBIT 200MHZ 165TFBGA RoHS:否 類別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 產(chǎn)品變化通告:Product Discontinuation 26/Apr/2010 標(biāo)準(zhǔn)包裝:136 系列:- 格式 - 存儲(chǔ)器:RAM 存儲(chǔ)器類型:SRAM - 同步,DDR II 存儲(chǔ)容量:18M(1M x 18) 速度:200MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.9 V 工作溫度:0°C ~ 70°C 封裝/外殼:165-TBGA 供應(yīng)商設(shè)備封裝:165-CABGA(13x15) 包裝:托盤 其它名稱:71P71804S200BQ
CY7C1520AV18-200BZI 制造商:Rochester Electronics LLC 功能描述: 制造商:Cypress Semiconductor 功能描述:
CY7C1520AV18-200BZXI 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 2Mx36 1.8V DDR-II (2-Word Burst) RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1520AV18-250BZC 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 2M x 36 1.8V DDR II 靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray