參數(shù)資料
型號： CY7C1393BV18-167BZC
廠商： CYPRESS SEMICONDUCTOR CORP
元件分類： DRAM
英文描述： 18-Mbit DDR-II SIO SRAM 2-Word Burst Architecture
中文描述： 1M X 18 DDR SRAM, 0.5 ns, PBGA165
封裝： 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
文件頁數(shù)： 10/27頁
文件大?。?/td> 446K
代理商： CY7C1393BV18-167BZC
CY7C1392BV18
CY7C1992BV18
CY7C1393BV18
CY7C1394BV18
Document Number: 38-05623 Rev. *C
Page 10 of 27
Write Cycle Descriptions
(CY7C1394BV18)
[2, 8]
BWS
0
L
BWS
1
L
BWS
2
L
BWS
3
L
K
K
–
Comments
L-H
During the Data portion of a Write sequence, all four bytes (D
[35:0]
) are written into
the device.
L-H During the Data portion of a Write sequence, all four bytes (D
[35:0]
) are written into
the device.
-
During the Data portion of a Write sequence, only the lower byte (D
[8:0]
) is written
into the device. D
[35:9]
will remain unaltered.
L-H During the Data portion of a Write sequence, only the lower byte (D
[8:0]
) is written
into the device. D
[35:9]
will remain unaltered.
–
During the Data portion of a Write sequence, only the byte (D
[17:9]
) is written into
the device. D
[8:0]
and D
[35:18]
will remain unaltered.
L-H During the Data portion of a Write sequence, only the byte (D
[17:9]
) is written into
the device. D
[8:0]
and D
[35:18]
will remain unaltered.
–
During the Data portion of a Write sequence, only the byte (D
[26:18]
) is written into
the device. D
[17:0]
and D
[35:27]
will remain unaltered.
L-H During the Data portion of a Write sequence, only the byte (D
[26:18]
) is written into
the device. D
[17:0]
and D
[35:27]
will remain unaltered.
During the Data portion of a Write sequence, only the byte (D
[35:27]
) is written into
the device. D
[26:0]
will remain unaltered.
L-H During the Data portion of a Write sequence, only the byte (D
[35:27]
) is written into
the device. D
[26:0]
will remain unaltered.
–
No data is written into the device during this portion of a Write operation.
L-H No data is written into the device during this portion of a Write operation.
L
L
L
L
–
L
H
H
H
L-H
L
H
H
H
–
H
L
H
H
L-H
H
L
H
H
–
H
H
L
H
L-H
H
H
L
H
–
H
H
H
L
L-H
H
H
H
L
–
H
H
H
H
H
H
H
H
L-H
–
Write Cycle Descriptions
(CY7C1992BV18)
[2, 8]
BWS
0
L
L
H
H
K
K
–
Comments
L-H
–
L-H
–
During the Data portion of a Write sequence, the single byte (D
[8:0]
) is written into the device.
During the Data portion of a Write sequence, the single byte (D
[8:0]
) is written into the device.
No data is written into the device during this portion of a Write operation.
No data is written into the device during this portion of a Write operation.
L-H
–
L-H
[+] Feedback
相關PDF資料
PDF描述
CY7C1393BV18-167BZI 18-Mbit DDR-II SIO SRAM 2-Word Burst Architecture
CY7C1393BV18-167BZXC 18-Mbit DDR-II SIO SRAM 2-Word Burst Architecture
CY7C1393BV18-167BZXI 18-Mbit DDR-II SIO SRAM 2-Word Burst Architecture
CY7C1393BV18-200BZC 18-Mbit DDR-II SIO SRAM 2-Word Burst Architecture
CY7C1393BV18-200BZI 18-Mbit DDR-II SIO SRAM 2-Word Burst Architecture
相關代理商/技術參數(shù)
參數(shù)描述
CY7C1393BV18-250BZI 功能描述:靜態(tài)隨機存取存儲器 1Mx18 1.8V IND DDR II SIO 靜態(tài)隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1393BV18-278BZC 功能描述:靜態(tài)隨機存取存儲器 1Mx18 1.8V COM DDR II SIO 靜態(tài)隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1393CV18-250BXZC 制造商:Rochester Electronics LLC 功能描述: 制造商:Cypress Semiconductor 功能描述:
CY7C1393CV18-250BZXC 功能描述:靜態(tài)隨機存取存儲器 1Mx18 1.8V DDRII SIO (2-Word Burst) RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1393DC 制造商:Cypress Semiconductor 功能描述:
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