參數(shù)資料
型號: CY7C1381D-133BGC
廠商: CYPRESS SEMICONDUCTOR CORP
元件分類: DRAM
英文描述: 18-Mbit (512K x 36/1M x 18) Flow-Through SRAM
中文描述: 512K X 36 CACHE SRAM, 6.5 ns, PBGA119
封裝: 14 X 22 MM, 2.40 MM HEIGHT, BGA-119
文件頁數(shù): 25/29頁
文件大小: 477K
代理商: CY7C1381D-133BGC
PRELIMINARY
CY7C1381D
CY7C1383D
Document #: 38-05544 Rev. *A
Page 25 of 29
Timing Diagrams
(continued)
tZZ
I
SUPPLY
CLK
ZZ
tZZREC
ALL INPUTS
(except ZZ)
DON’T CARE
IDDZZ
tZZI
tRZZI
Outputs (Q)
High-Z
DESELECT or READ Only
ZZ Mode Timing
[29, 30]
Ordering Information
Speed
(MHz)
133
Ordering Code
CY7C1381D-133AXC
CY7C1383D-133AXC
CY7C1381D-133BGC
CY7C1383D-133BGC
CY7C1381D-133BZC
CY7C1383D-133BZC
CY7C1381D-133BGXC
CY7C1383D-133BGXC
CY7C1381D-133BZXC
CY7C1383D-133BZXC
CY7C1381D-100AXC
CY7C1383D-100AXC
CY7C1381D-100BGC
CY7C1383D-100BGC
CY7C1381D-100BZC
CY7C1383D-100BZC
CY7C1381D-100BGXC
CY7C1383D-100BGXC
CY7C1381D-100BZXC
CY7C1383D-100BZXC
Package
Name
A101
Part and Package Type
Operating
Range
Commercial
Lead-Free 100-lead Thin Quad Flat Pack (14 x 20 x 1.4mm) 3
Chip Enables
119-ball (14 x 22 x 2.4 mm)
BGA 3 Chip Enables and JTAG
BG119
BB165D
165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4mm)
3 Chip Enables and JTAG
Lead-Free 119-ball (14 x 22 x 2.4 mm)
BGA 3 Chip Enables
and JTAG
Lead-Free 165-ball Fine-Pitch Ball Grid Array (13 x 15 x
1.4mm) 3 Chip Enables and JTAG
Lead-Free 100-lead Thin Quad Flat Pack (14 x 20 x 1.4mm) 3
Chip Enables
119-ball (14 x 22 x 2.4 mm)
BGA 3 Chip Enables and JTAG
BG119
BB165D
100
A101
Commercial
BG119
BB165D
165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4mm)
3 Chip Enables and JTAG
BG119
Lead-Free 119-ball (14 x 22 x 2.4 mm)
BGA 3 Chip Enables
and JTAG
BB165D
Lead-Free 165-ball Fine-Pitch Ball Grid Array (13 x 15 x
1.4mm) 3 Chip Enables and JTAG
Notes:
29.Device must be deselected when entering ZZ mode. See Cycle Descriptions table for all possible signal conditions to deselect the device.
30.DQs are in high-Z when exiting ZZ sleep mode.
相關(guān)PDF資料
PDF描述
CY7C1381D-133BGXC 18-Mbit (512K x 36/1M x 18) Flow-Through SRAM
CY7C1381D-133BZC 18-Mbit (512K x 36/1M x 18) Flow-Through SRAM
CY7C1381D-133BZXC 18-Mbit (512K x 36/1M x 18) Flow-Through SRAM
CY7C1383D 18-Mbit (512K x 36/1M x 18) Flow-Through SRAM
CY7C1383D-100AXC 18-Mbit (512K x 36/1M x 18) Flow-Through SRAM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CY7C1381D-133BGXC 功能描述:IC SRAM 18MBIT 133MHZ 165LFBGA RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:- 標準包裝:1,000 系列:- 格式 - 存儲器:RAM 存儲器類型:移動 SDRAM 存儲容量:256M(8Mx32) 速度:133MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.95 V 工作溫度:-40°C ~ 85°C 封裝/外殼:90-VFBGA 供應(yīng)商設(shè)備封裝:90-VFBGA(8x13) 包裝:帶卷 (TR) 其它名稱:557-1327-2
CY7C1381D-133BZI 制造商:Cypress Semiconductor 功能描述:
CY7C1381DV25-133AXC 制造商:Cypress Semiconductor 功能描述:
CY7C1381F-133BGC 功能描述:靜態(tài)隨機存取存儲器 512Kx36 3.3V Sync FT 靜態(tài)隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1381F-133BGCT 功能描述:靜態(tài)隨機存取存儲器 512Kx36 3.3V Sync FT 靜態(tài)隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray