參數(shù)資料
型號: CY7C1370C-200BGI
廠商: CYPRESS SEMICONDUCTOR CORP
元件分類: DRAM
英文描述: 512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture
中文描述: 512K X 36 ZBT SRAM, 3 ns, PBGA119
封裝: 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119
文件頁數(shù): 20/27頁
文件大?。?/td> 704K
代理商: CY7C1370C-200BGI
CY7C1370C
CY7C1372C
Document #: 38-05233 Rev. *D
Page 20 of 27
Set-up Times
t
AS
t
DS
t
CENS
t
WES
t
ALS
t
CES
Hold Times
t
AH
t
DH
t
CENH
t
WEH
t
ALH
t
CEH
Address Set-up Before CLK Rise
Data Input Set-up Before CLK Rise
1.2
1.2
1.2
1.2
1.2
1.2
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.5
1.5
1.5
1.5
1.5
1.5
ns
ns
ns
ns
ns
ns
CEN Set-up Before CLK Rise
WE, BW
x
Set-up Before CLK Rise
ADV/LD Set-up Before CLK Rise
Chip Select Set-up
Address Hold After CLK Rise
Data Input Hold After CLK Rise
0.3
0.3
0.3
0.3
0.3
0.3
0.4
0.4
0.4
0.4
0.4
0.4
0.4
0.4
0.4
0.4
0.4
0.4
0.5
0.5
0.5
0.5
0.5
0.5
ns
ns
ns
ns
ns
ns
CEN Hold After CLK Rise
WE, BW
x
Hold After CLK Rise
ADV/LD Hold after CLK Rise
Chip Select Hold After CLK Rise
Switching Characteristics
Over the Operating Range
[ 21, 22]
(continued)
Parameter
Description
-250
-225
-200
-167
Unit
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Switching Waveforms
Read/Write/Timing
[23,24,25]
Notes:
23.For this waveform ZZ is tied low.
24.When CE is LOW, CE
is LOW, CE
is HIGH and CE
is LOW. When CE is HIGH,CE
is HIGH or CE
is LOW or CE
is HIGH.
25.Order of the Burst sequence is determined by the status of the MODE (0=Linear, 1=Interleaved).Burst operations are optional.
WRITE
D(A1)
1
2
3
4
5
6
7
8
9
CLK
tCYC
t
CL
t
CH
10
CE
t
CEH
t
CES
WE
CEN
t
CENH
t
CENS
BW
x
ADV/LD
t
AH
t
AS
ADDRESS
A1
A2
A3
A4
A5
A6
A7
t
DH
t
DS
Data
In-Out (DQ)
t
CLZ
D(A1)
D(A2)
D(A5)
Q(A4)
Q(A3)
D(A2+1)
t
DOH
t
CHZ
t
CO
WRITE
D(A2)
BURST
WRITE
D(A2+1)
READ
Q(A3)
READ
Q(A4)
BURST
READ
Q(A4+1)
WRITE
D(A5)
READ
Q(A6)
WRITE
D(A7)
DESELECT
OE
t
OEV
t
OELZ
t
OEHZ
t
DOH
DON’T CARE
UNDEFINED
Q(A6)
Q(A4+1)
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