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參數(shù)資料
| 型號(hào)： | CY7C1354CV25-200BZXC |
| 廠商： | CYPRESS SEMICONDUCTOR CORP |
| 元件分類： | DRAM |
| 英文描述： | 9-Mbit (256K x 36/512K x 18) Pipelined SRAM with NoBL⑩ Architecture |
| 中文描述： | 256K X 36 ZBT SRAM, 3.2 ns, PBGA165 |
| 封裝： | 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 |
| 文件頁數(shù)： | 27/28頁 |
| 文件大小： | 444K |
| 代理商： | CY7C1354CV25-200BZXC |
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CY7C1354CV25
CY7C1356CV25
Document #: 38-05537 Rev. *H
Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Page 27 of 28
Package Diagrams
(continued)
NoBL and No Bus Latency are trademarks of Cypress Semiconductor Corporation. ZBT is a trademark of Integrated Device
Technology, Inc. All product and company names mentioned in this document are the trademarks of their respective holders
A
1
PIN 1 CORNER
1
13.00±0.10
7
1.00
0.50 (165X)
0.25 M C A B
0.05 M C
B
A
0.15(4X)
0
SEATING PLANE
0
0
0
PIN 1 CORNER
TOP VIEW
BOTTOM VIEW
2
3
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5
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9
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10.00
1
B
C
D
E
F
G
H
J
K
L
M
N
11
11
10
9
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2
1
P
R
P
R
K
M
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J
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B
A
A
1
13.00±0.10
B
C
1
5.00
0
SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)
PACKAGE WEIGHT : 0.475g
JEDEC REFERENCE : MO-216 / DESIGN 4.6C
PACKAGE CODE : BB0AC
NOTES :
51-85180-*A
165-Ball FBGA (13 x 15 x 1.4 mm) (51-85180)
[+] Feedback
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| CY7C1354CV25-200BZXI | 9-Mbit (256K x 36/512K x 18) Pipelined SRAM with NoBL⑩ Architecture |
| CY7C1356CV25 | 9-Mbit (256K x 36/512K x 18) Pipelined SRAM with NoBL⑩ Architecture |
| CY7C1356CV25-166AXC | 9-Mbit (256K x 36/512K x 18) Pipelined SRAM with NoBL⑩ Architecture |
| CY7C1356CV25-166AXI | 9-Mbit (256K x 36/512K x 18) Pipelined SRAM with NoBL⑩ Architecture |
| CY7C1355C-100BGXC | 9-Mbit (256K x 36/512K x 18) Flow-Through SRAM with NoBL⑩ Architecture |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CY7C1354CV25-200CKJ | 制造商:Cypress Semiconductor 功能描述: |
| CY7C1354D-200BZC | 制造商:Cypress Semiconductor 功能描述:SYNC SRAMS - Trays 制造商:Cypress Semiconductor 功能描述:IC SRAM 9MBIT 200MHZ 165FBGA |
| CY7C1354DV25-200BZI | 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 256Kbx36 2.4V-2.6V 9Mb 200MHz PIPELINE RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |
| CY7C1354S-166AXC | 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 CY7C1354S-166AXC RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |
| CY7C1354S-166BGC | 功能描述:IC SRAM 256KX36 3.3V SYNC 119BGA RoHS:否 類別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:- 格式 - 存儲(chǔ)器:EEPROMs - 串行 存儲(chǔ)器類型:EEPROM 存儲(chǔ)容量:4K (512 x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:8-MFP 包裝:帶卷 (TR) |
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