參數(shù)資料
型號(hào): CY7C1354CV25-167BZXC
廠(chǎng)商: Cypress Semiconductor Corp.
英文描述: 9-Mbit ( 256K x 36/512K x 18 ) Pipelined SRAM with NoBL-TM Architecture
中文描述: 9兆位(256 × 36/512K × 18)流水線(xiàn)的SRAM的總線(xiàn)延遲,TM架構(gòu)
文件頁(yè)數(shù): 21/25頁(yè)
文件大?。?/td> 353K
代理商: CY7C1354CV25-167BZXC
PRELIMINARY
CY7C1354CV25
CY7C1356CV25
Document #: 38-05537 Rev. *B
Page 21 of 25
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CY7C1354CV25-167AXC
CY7C1356CV25-167AXC
CY7C1354CV25-167AXI
CY7C1356CV25-167AXI
CY7C1354CV25-167BGC
CY7C1356CV25-167BGC
CY7C1354CV25-167BGI
CY7C1356CV25-167BGI
CY7C1354CV25-167BZC
CY7C1356CV25-167BZC
CY7C1354CV25-167BZI
CY7C1356CV25-167BZI
CY7C1354CV25-167BGXC
CY7C1356CV25-167BGXC
CY7C1354CV25-167BGXI
CY7C1356CV25-167BGXI
CY7C1354CV25-167BZXC
CY7C1356CV25-167BZXC
CY7C1354CV25-167BZXI
CY7C1356CV25-167BZXI
A101
Lead-Free 100-lead Thin Quad Flat Pack (14 x 20 x
1.4 mm)
Commercial
A101
Lead-Free 100-lead Thin Quad Flat Pack (14 x 20 x
1.4 mm)
Industrial
BG119
119-ball Ball Grid Array (14 x 22 x 2.4 mm)
Commercial
BG119
119-ball Ball Grid Array (14 x 22 x 2.4 mm)
Industrial
BB165D
165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
Commercial
BB165D
165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
Industrial
BG119
Lead-Free 119-ball Ball Grid Array (14 x 22 x 2.4 mm)
Commercial
BG119
Lead-Free 119-ball Ball Grid Array (14 x 22 x 2.4 mm)
Industrial
BB165D
Lead-Free 165-ball Fine Pitch Ball Grid Array (13 x
15 x 1.4 mm)
Commercial
BB165D
Lead-Free 165-ball Fine Pitch Ball Grid Array (13 x
15 x 1.4 mm)
Industrial
Shaded areas contain advance information. Please contact your local Cypress sales representative for availability of these parts. Lead-free BGX package will be
available in 2005.
Ordering Information
(continued)
Speed
(MHz)
Ordering Code
Package
Name
Package Type
Operating
Range
相關(guān)PDF資料
PDF描述
CY7C1354CV25-167BZXI 9-Mbit ( 256K x 36/512K x 18 ) Pipelined SRAM with NoBL-TM Architecture
CY7C1354CV25-225AXC 9-Mbit ( 256K x 36/512K x 18 ) Pipelined SRAM with NoBL-TM Architecture
CY7C1354CV25-225AXI 9-Mbit ( 256K x 36/512K x 18 ) Pipelined SRAM with NoBL-TM Architecture
CY7C1354CV25-225BGC 9-Mbit ( 256K x 36/512K x 18 ) Pipelined SRAM with NoBL-TM Architecture
CY7C1354CV25-225BGI 9-Mbit ( 256K x 36/512K x 18 ) Pipelined SRAM with NoBL-TM Architecture
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CY7C1354CV25-200AXC 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 256Kx36 2.5V NoBL Sync PL 靜態(tài)隨機(jī)存取存儲(chǔ)器 COM RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪(fǎng)問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1354CV25-200AXCT 功能描述:IC SRAM 9MBIT 200MHZ 100LQFP RoHS:是 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 系列:NoBL™ 標(biāo)準(zhǔn)包裝:1,000 系列:- 格式 - 存儲(chǔ)器:RAM 存儲(chǔ)器類(lèi)型:移動(dòng) SDRAM 存儲(chǔ)容量:256M(8Mx32) 速度:133MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.95 V 工作溫度:-40°C ~ 85°C 封裝/外殼:90-VFBGA 供應(yīng)商設(shè)備封裝:90-VFBGA(8x13) 包裝:帶卷 (TR) 其它名稱(chēng):557-1327-2
CY7C1354CV25-200BZC 制造商:Cypress Semiconductor 功能描述:CY7C1354CV25 9 Mb (256 K x 36) 200 MHz 2.5 V Pipelined SRAM - BGA-165 制造商:Cypress Semiconductor 功能描述:CY7C1354CV25 9 Mb (256 K x 36) 200 MHz 2.5 V Pipelined SRAM - FBGA-165
CY7C1354CV25-200CKJ 制造商:Cypress Semiconductor 功能描述:
CY7C1354D-200BZC 制造商:Cypress Semiconductor 功能描述:SYNC SRAMS - Trays 制造商:Cypress Semiconductor 功能描述:IC SRAM 9MBIT 200MHZ 165FBGA