參數(shù)資料
型號： CY7C1354C-200BGI
廠商： CYPRESS SEMICONDUCTOR CORP
元件分類： DRAM
英文描述： 9-Mbit (256K x 36/512K x 18) Pipelined SRAM with NoBL⑩ Architecture
中文描述： 256K X 36 ZBT SRAM, 3.2 ns, PBGA119
封裝： (14 X 22 X 2.4) MM, PLASTIC, BGA-119
文件頁數(shù)： 27/28頁
文件大小： 467K
代理商： CY7C1354C-200BGI
CY7C1354C
CY7C1356C
Document #: 38-05538 Rev. *G
Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Page 27 of 28
Package Diagrams
(continued)
NoBL and No Bus Latency are trademarks of Cypress Semiconductor Corporation. ZBT is a trademark of Integrated Device
Technology, Inc. All product and company names mentioned in this document are the trademarks of their respective holders
A
PIN 1 CORNER
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0.50 (0.25 M C A B
0.25 M0.05 M C
0.05 M C
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SEATING PLANE
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TOP VIEW
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SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)
PACKAGE WEIGHT : 0.475g
JEDEC REFERENCE : MO-216 / DESIGN 4.6C
PACKAGE CODE : BB0AC
PACKAGE CODE : BB0AC
51-85180-*A
165 FBGA 13 x 15 x 1.40 MM BB165D/BW165D
165-Ball FBGA (13 x 15 x 1.4 mm) (51-85180)
A
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13.00±0.10
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TOP VIEW
BOTTOM VIEW
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51-85180-*A
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相關(guān)PDF資料
PDF描述
CY7C1354C-200BGXC 9-Mbit (256K x 36/512K x 18) Pipelined SRAM with NoBL⑩ Architecture
CY7C1354C-200BGXI 9-Mbit (256K x 36/512K x 18) Pipelined SRAM with NoBL⑩ Architecture
CY7C1354C-200BZC 9-Mbit (256K x 36/512K x 18) Pipelined SRAM with NoBL⑩ Architecture
CY7C1356C-166BZXI 9-Mbit (256K x 36/512K x 18) Pipelined SRAM with NoBL⑩ Architecture
CY7C1356C-200AXC 9-Mbit (256K x 36/512K x 18) Pipelined SRAM with NoBL⑩ Architecture
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CY7C1354C-225AXC 功能描述:靜態(tài)隨機(jī)存取存儲器 256Kx36 3.3V NoBL Sync PL COM RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1354C-250AXC 制造商:Cypress Semiconductor 功能描述:
CY7C1354C-250AXCKJ 制造商:Cypress Semiconductor 功能描述:
CY7C1354CV25-166AXC 功能描述:靜態(tài)隨機(jī)存取存儲器 256Kx36 2.5V NoBL Sync PL 靜態(tài)隨機(jī)存取存儲器 COM RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1354CV25-166AXCT 功能描述:靜態(tài)隨機(jī)存取存儲器 256Kx36 2.5V NoBL Sync PL 靜態(tài)隨機(jī)存取存儲器 COM RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
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