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參數(shù)資料
| 型號： | CY7C1354C-166BZXI |
| 廠商： | CYPRESS SEMICONDUCTOR CORP |
| 元件分類： | DRAM |
| 英文描述： | 9-Mbit (256K x 36/512K x 18) Pipelined SRAM with NoBL⑩ Architecture |
| 中文描述： | 256K X 36 ZBT SRAM, 3.5 ns, PBGA165 |
| 封裝： | (13 X 15 X 1.4) MM, LEAD FREE, PLASTIC, FBGA-165 |
| 文件頁數(shù)： | 8/28頁 |
| 文件大小： | 467K |
| 代理商： | CY7C1354C-166BZXI |
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CY7C1354C
CY7C1356C
Document #: 38-05538 Rev. *G
Page 8 of 28
Because the CY7C1354C and CY7C1356C are common I/O
devices, data should not be driven into the device while the
outputs are active. The Output Enable (OE) can be deasserted
HIGH before presenting data to the DQ
and DQP
(DQ
a,b,c,d
/DQP
a,b,c,d
for CY7C1354C and DQ
a,b
/DQP
a,b
for
CY7C1356C) inputs. Doing so will tri-state the output drivers.
As a safety precaution, DQ
and DQP
(DQ
a,b,c,d
/DQP
a,b,c,d
for
CY7C1354C and DQ
a,b
/DQP
a,b
for CY7C1356C) are
automatically tri-stated during the data portion of a write cycle,
regardless of the state of OE.
Burst Write Accesses
The CY7C1354C/CY7C1356C has an on-chip burst counter
that allows the user the ability to supply a single address and
conduct up to four WRITE operations without reasserting the
address inputs. ADV/LD must be driven LOW in order to load
the initial address, as described in the Single Write Access
section above. When ADV/LD is driven HIGH on the subse-
quent clock rise, the chip enables (CE
1
, CE
2
, and CE
3
) and
WE inputs are ignored and the burst counter is incremented.
The correct BW (BW
a,b,c,d
for CY7C1354C and BW
a,b
for
CY7C1356C) inputs must be driven in each cycle of the burst
write in order to write the correct bytes of data.
Sleep Mode
The ZZ input pin is an asynchronous input. Asserting ZZ
places the SRAM in a power conservation “sleep” mode. Two
clock cycles are required to enter into or exit from this “sleep”
ZZ Mode Electrical Characteristics
mode. While in this mode, data integrity is guaranteed.
Accesses pending when entering the “sleep” mode are not
considered valid nor is the completion of the operation
guaranteed. The device must be deselected prior to entering
the “sleep” mode. CE
1
, CE
2
, and CE
3,
must remain inactive for
the duration of t
ZZREC
after the ZZ input returns LOW.
Interleaved Burst Address Table
(MODE = Floating or V
DD
)
First
Address
Address
A1,A0
A1,A0
00
01
01
00
10
11
11
10
Linear Burst Address Table (MODE = GND)
Second
Third
Address
A1,A0
10
11
00
01
Fourth
Address
A1,A0
11
10
01
00
First
Address
A1,A0
00
01
10
11
Second
Address
A1,A0
01
10
11
00
Third
Address
A1,A0
10
11
00
01
Fourth
Address
A1,A0
11
00
01
10
Parameter
I
DDZZ
t
ZZS
t
ZZREC
t
ZZI
t
RZZI
Truth Table
[2, 3, 4, 5, 6, 7, 8]
Description
Test Conditions
Min.
Max.
50
2t
CYC
Unit
mA
ns
ns
ns
ns
Sleep mode standby current
Device operation to ZZ
ZZ recovery time
ZZ active to sleep current
ZZ Inactive to exit sleep current
ZZ
>
V
DD
0.2V
ZZ
>
V
DD
0.2V
ZZ
<
0.2V
This parameter is sampled
This parameter is sampled
2t
CYC
2t
CYC
0
Operation
Address
Used
None
None
External
Next
External
Next
External
Next
CE ZZ
H
X
L
X
L
X
L
X
ADV/LD
L
H
L
H
L
H
L
H
WE
X
X
H
X
H
X
L
X
BWx
X
X
X
X
X
X
L
L
OE
X
X
L
L
H
H
X
X
CEN
L
L
L
L
L
L
L
L
CLK
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
DQ
Deselect Cycle
Continue Deselect Cycle
Read Cycle (Begin Burst)
Read Cycle (Continue Burst)
NOP/Dummy Read (Begin Burst)
Dummy Read (Continue Burst)
Write Cycle (Begin Burst)
Write Cycle (Continue Burst)
L
L
L
L
L
L
L
L
Tri-State
Tri-State
Data Out (Q)
Data Out (Q)
Tri-State
Tri-State
Data In (D)
Data In (D)
Notes:
2. X = “Don't Care”, H = Logic HIGH, L = Logic LOW, CE stands for ALL Chip Enables active. BWx = L signifies at least one Byte Write Select is active, BWx =
Valid signifies that the desired Byte Write Selects are asserted, see Write Cycle Description table for details.
3. Write is defined by WE and BW
. See Write Cycle Description table for details.
4. When a write cycle is detected, all I/Os are tri-stated, even during Byte Writes.
5. The DQ and DQP pins are controlled by the current cycle and the OE signal.
6. CEN = H inserts wait states.
7. Device will power-up deselected and the I/Os in a tri-state condition, regardless of OE.
8. OE is asynchronous and is not sampled with the clock rise. It is masked internally during write cycles. During a read cycle DQs and DQP
X
= Tri-state when OE
is inactive or when the device is deselected, and DQs = data when OE is active.
[+] Feedback
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| CY7C1354C-167AXC | 功能描述:IC SRAM 9MBIT 167MHZ 100LQFP RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:NoBL™ 標(biāo)準(zhǔn)包裝:1,000 系列:- 格式 - 存儲器:RAM 存儲器類型:移動 SDRAM 存儲容量:256M（8Mx32） 速度:133MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.95 V 工作溫度:-40°C ~ 85°C 封裝/外殼:90-VFBGA 供應(yīng)商設(shè)備封裝:90-VFBGA（8x13） 包裝:帶卷 (TR) 其它名稱:557-1327-2 |
| CY7C1354C-200AXC | 功能描述:靜態(tài)隨機存取存儲器 256Kx36 3.3V NoBL Sync PL COM RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |
| CY7C1354C-200AXCT | 功能描述:靜態(tài)隨機存取存儲器 256Kx36 3.3V NoBL Sync PL COM RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |
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| CY7C1354C-200AXIKJ | 制造商:Cypress Semiconductor 功能描述: |
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