參數(shù)資料
型號(hào)： CY7C1241V18-300BZXI
廠商： CYPRESS SEMICONDUCTOR CORP
元件分類： DRAM
英文描述： 36-Mbit QDR⑩-II+ SRAM 4-Word Burst Architecture (2.0 Cycle Read Latency)
中文描述： 4M X 8 QDR SRAM, 0.45 ns, PBGA165
封裝： 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
文件頁(yè)數(shù)： 1/28頁(yè)
文件大?。?/td> 1042K
代理商： CY7C1241V18-300BZXI
36-Mbit QDR-II+ SRAM 4-Word
Burst Architecture (2.0 Cycle Read Latency)
CY7C1241V18
CY7C1256V18
CY7C1243V18
CY7C1245V18
Cypress Semiconductor Corporation
Document Number: 001-06365 Rev. *C
198 Champion Court
San Jose
,
CA 95134-1709
408-943-2600
Revised May 11, 2007
Features
Separate independent read and write data ports
— Supports concurrent transactions
300 MHz to 375 MHz clock for high bandwidth
4-Word Burst for reducing address bus frequency
Double Data Rate (DDR) interfaces on both read and write
ports (data transferred at 750 MHz) at 375 MHz
Read latency of 2.0 clock cycles
Two input clocks (K and K) for precise DDR timing
— SRAM uses rising edges only
Echo clocks (CQ and CQ) simplify data capture in
high-speed systems
Single multiplexed address input bus latches address inputs
for both read and write ports
Separate Port Selects for depth expansion
Data valid pin (QVLD) to indicate valid data on the output
Synchronous internally self-timed writes
Available in x8, x9, x18, and x36 configurations
Full data coherency providing most current data
Core V
DD
= 1.8V ± 0.1V; IO V
DDQ
= 1.4V to V
DD[1]
HSTL inputs and Variable drive HSTL output buffers
Available in 165-ball FBGA package (15 x 17 x 1.4 mm)
Offered in both Pb-free and non Pb-free packages
JTAG 1149.1 compatible test access port
Delay Lock Loop (DLL) for accurate data placement
Configurations
With Read Cycle Latency of 2.0 cycles:
CY7C1241V18 – 4M x 8
CY7C1256V18 – 4M x 9
CY7C1243V18 – 2M x 18
CY7C1245V18 – 1M x 36
Functional Description
The CY7C1241V18, CY7C1256V18, CY7C1243V18, and
CY7C1245V18 are 1.8V Synchronous Pipelined SRAMs,
equipped with Quad Data Rate-II+ (QDR-II+) architecture.
QDR-II+ architecture consists of two separate ports to access
the memory array. The read port has dedicated data outputs
to support read operations and the write port has dedicated
data inputs to support write operations. QDR-II+ architecture
has separate data inputs and data outputs to completely
eliminate the need to “turn around” the data bus required with
common IO devices. Each port can be accessed through a
common address bus. Read and write addresses are latched
on alternate rising edges of the input (K) clock. Accesses to
the QDR-II+ read and write ports are completely independent
of one another. To maximize data throughput, both read and
write ports are equipped with Double Data Rate (DDR) inter-
faces. Each address location is associated with four 8-bit
words (CY7C1241V18), 9-bit words (CY7C1256V18), 18-bit
words (CY7C1243V18), or 36-bit words (CY7C1245V18), that
burst sequentially into or out of the device. Because data can
be transferred into and out of the device on every rising edge
of both input clocks (K and K), memory bandwidth is
maximized while simplifying system design by eliminating bus
“turn-arounds”.
Depth expansion is accomplished with Port Selects for each
port. Port selects enable each port to operate independently.
All synchronous inputs pass through input registers controlled
by the K or K input clocks. All data outputs pass through output
registers controlled by the K or K input clocks. Writes are
conducted with on-chip synchronous self-timed write circuitry.
Selection Guide
375 MHz
375
1240
333 MHz
333
1120
300 MHz
300
1040
Unit
MHz
mA
Maximum Operating Frequency
Maximum Operating Current
Note
1. The QDR consortium specification for V
DDQ
is 1.5V + 0.1V. The Cypress QDR devices exceed the QDR consortium specification and are capable of supporting
V
DDQ
= 1.4V to V
DD
.
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相關(guān)PDF資料
PDF描述
CY7C1243V18 36-Mbit QDR⑩-II+ SRAM 4-Word Burst Architecture (2.0 Cycle Read Latency)
CY7C1243V18-300BZC 36-Mbit QDR⑩-II+ SRAM 4-Word Burst Architecture (2.0 Cycle Read Latency)
CY7C1243V18-300BZXC 36-Mbit QDR⑩-II+ SRAM 4-Word Burst Architecture (2.0 Cycle Read Latency)
CY7C1243V18-300BZXI 36-Mbit QDR⑩-II+ SRAM 4-Word Burst Architecture (2.0 Cycle Read Latency)
CY7C1245V18 36-Mbit QDR⑩-II+ SRAM 4-Word Burst Architecture (2.0 Cycle Read Latency)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CY7C1243KV18-400BZC 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 36MB (2Mx18) 1.8v 400MHz QDR II 靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1243KV18-450BZC 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 36MB (2Mx18) 1.8v 450MHz QDR II 靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C12451KV18-400BZC 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 1Mb x 36 400 MHz Sync 靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C12451KV18-400BZXC 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 1M X 36 400MHz QDR II+ 靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1245KV18-400BZC 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 36MB (1Mx36) 1.8v 400MHz QDR II 靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
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