參數(shù)資料
型號(hào)： CY7C0831AV
廠商： Cypress Semiconductor Corp.
英文描述： FLEx18 3.3V 64K/128K x 36 and 128K/256K x 18 Synchronous Dual-Port RAM(FLEx18 3.3V 64K/128K x 36和128K/256K x 18同步雙端口RAM)
中文描述： FLEx18 3.3 64K/128K × 36和128K/256K × 18同步雙口RAM（FLEx18 3.3 64K/128K × 36和128K/256K × 18同步雙端口RAM）的
文件頁數(shù)： 10/28頁
文件大小： 775K
代理商： CY7C0831AV
CY7C0837AV
CY7C0830AV/CY7C0831AV
CY7C0832AV/CY7C0833AV
Document #: 38-06059 Rev. *Q
Page 10 of 28
IEEE 1149.1 Serial Boundary Scan (JTAG)
[20]
The FLEx18 family devices incorporate an IEEE 1149.1 serial
boundary scan test access port (TAP). The TAP controller
functions in a manner that does not conflict with the operation
of other devices using 1149.1-compliant TAPs. The TAP
operates using JEDEC-standard 3.3V I/O logic levels. It is
composed of three input connections and one output
connection required by the test logic defined by the standard.
Performing a TAP Reset
A reset is performed by forcing TMS HIGH (V
DD
) for five rising
edges of TCK. This reset does not affect the operation of the
devices, and may be performed while the device is operating.
An MRST must be performed on the devices after power-up.
Performing a Pause/Restart
When a SHIFT-DR PAUSE-DR SHIFT-DR is performed the
scan chain will output the next bit in the chain twice. For
example, if the value expected from the chain is 1010101, the
device will output a 11010101. This extra bit will cause some
testers to report an erroneous failure for the devices in a scan
test. Therefore the tester should be configured to never enter
the PAUSE-DR state.
Boundary Scan Hierarchy for 9-Mbit Device
Internally, the CY7C0833AV have two DIEs. Each DIE contain
all the circuitry required to support boundary scan testing. The
circuitry includes the TAP, TAP controller, instruction register,
and data registers. The circuity and operation of the DIE
boundary scan are described in detail below. The scan chain
of each DIE are connected serially to form the scan chain of
the CY7C0833AV as shown in
Figure 3
. TMS and TCK are
connected in parallel to each DIE to drive all TAP controllers
in unison. In many cases, each DIE will be supplied with the
same instruction. In other cases, it might be useful to supply
different instructions to each DIE. One example would be
testing the device ID of one DIE while bypassing the others.
Each pin of FLEx18 family is typically connected to multiple
DIEs. For connectivity testing with the EXTEST instruction, it
is desirable to check the internal connections between DIEs
as well as the external connections to the package. This can
be accomplished by merging the netlist of the devices with the
netlist of the user’s circuit board. To facilitate boundary scan
testing of the devices, Cypress provides the BSDL file for each
DIE, the internal netlist of the device, and a description of the
device scan chain. The user can use these materials to easily
integrate the devices into the board’s boundary scan
environment. Further information can be found in the Cypress
application note
Using JTAG Boundary Scan For System in a
Package (SIP) Dual-Port SRAMs.
2
16
2
15
2
6
2
1
2
5
2
2
2
4
2
3
2
0
2
16
2
15
2
6
2
1
2
5
2
2
2
4
2
3
2
0
2
16
2
15
2
6
2
1
2
5
2
2
2
4
2
3
2
0
2
16
2
15
2
6
2
1
2
5
2
2
2
4
2
3
2
0
H
H
L
H
1
1
0s
1
0
1
0
1
0
1
0
0
Xs
1
X
0
X
0
X
0
1
1
Xs
1
X
1
X
1
X
1
0
0
Xs
1
X
0
X
0
X
0
Masked Address
Unmasked Address
Mask
Register
bit-0
Address
Counter
bit-0
CNTINT
Example:
Load
Counter-Mask
Register = 3F
Load
Address
Counter = 8
Max
Address
Register
Max + 1
Address
Register
Figure 2. Programmable Counter-Mask Register Operation
[1, 19]
Notes:
19.The “X” in this diagram represents the counter upper bits
20.Boundary scan is IEEE 1149.1-compatible. See “Performing a Pause/Restart” for deviation from strict 1149.1 compliance
相關(guān)PDF資料
PDF描述
CY7C0832AV FLEx18 3.3V 64K/128K x 36 and 128K/256K x 18 Synchronous Dual-Port RAM(FLEx18 3.3V 64K/128K x 36和128K/256K x 18同步雙端口RAM)
CY7C0833AV FLEx18 3.3V 64K/128K x 36 and 128K/256K x 18 Synchronous Dual-Port RAM(FLEx18 3.3V 64K/128K x 36和128K/256K x 18同步雙端口RAM)
CY7C0837AV FLEx18 3.3V 64K/128K x 36 and 128K/256K x 18 Synchronous Dual-Port RAM(FLEx18 3.3V 64K/128K x 36和128K/256K x 18同步雙端口RAM)
CY7C0851V FLEx36TM 3.3V 32K/64K/128K/256K x 36 Synchronous Dual-Port RAM(FLEx36TM 3.3V 32K/64K/128K/256K x 36同步雙端口RAM)
CY7C0852V FLEx36TM 3.3V 32K/64K/128K/256K x 36 Synchronous Dual-Port RAM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CY7C0831AV-133AC 制造商:Cypress Semiconductor 功能描述:SRAM SYNC DUAL 3.3V 2.25MBIT 128KX18 4.4NS 120TQFP - Trays
CY7C0831AV-133AXI 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 2MB (128Kx18) 3.3v 133MHz Synch 靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C0831AV-133BBC 制造商:Cypress Semiconductor 功能描述:
CY7C0831AV-133BBI 制造商:Cypress Semiconductor 功能描述: 制造商:Rochester Electronics LLC 功能描述:- Bulk
CY7C0831AV-133BBXI 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 Flex18 2M IND Sync DualPort RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購

我的聯(lián)系方式

*
*
*