參數(shù)資料
型號(hào): CMG02
廠商: Toshiba Corporation
英文描述: Zener Diode; Application: General; Pd (mW): 400; Vz (V): 10.2 to 10.6; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V):   ESD (kV) min: -; Package: MHD
中文描述: 通用整流器應(yīng)用
文件頁(yè)數(shù): 1/4頁(yè)
文件大小: 195K
代理商: CMG02
CMG02
2006-11-06
1
TOSHIBA Rectifier Silicon Diffused Type
CMG02
General Purpose Rectifier Applications
Average forward current: I
F (AV)
= 2.0 A
Repetitive peak reverse voltage: V
RRM
= 400 V
Suitable for compact assembly due to small surface-mount package
“M
FLAT
TM
” (Toshiba package name)
Absolute Maximum Ratings
(Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Repetitive peak reverse voltage
V
RRM
400
V
Average forward current
I
F (AV)
2.0
A
Non-repetitive peak surge current
I
FSM
80 (50 Hz)
A
Junction temperature
T
j
40 to 150
°C
Storage temperature
T
stg
40 to 150
°C
Note: Using continuously under heavy loads (e.g. the application of high
temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the
absolute maximum ratings.
Please design the appropriate reliability upon reviewing the
Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and
individual reliability data (i.e. reliability test report and estimated failure rate, etc).
Electrical Characteristics
(Ta
=
25°C)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
V
FM
1
I
FM
=1.0 A
0.86
V
Peak forward voltage
V
FM
2
I
FM
= 2.0 A
0.9
1.1
V
Peak repetitive reverse current
I
RRM
V
RRM
= 400 V
10
μ
A
Device mounted on a ceramic board
(board size: 50 mm
×
50 mm)
(soldering land: 2 mm
×
2 mm)
(board thickness: 0.64 t)
60
Device mounted on a glass-epoxy
board
(board size: 50 mm
×
50 mm)
(soldering land: 6 mm
×
6 mm)
(board thickness: 1.6 t)
110
Thermal resistance
(junction to ambient)
R
th (j-a)
Device mounted on a glass-epoxy
board
(board size: 50 mm
×
50 mm)
(soldering land: 2.1 mm
×
1.4 mm)
(board thickness: 1.6 t)
180
°C/W
Thermal resistance
(junction to lead)
R
th (j-
)
16
°C/W
Unit: mm
JEDEC
JEITA
TOSHIBA
3-4E1A
Weight: 0.023 g (typ.)
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